Accelerometer based on artificial intelligence design and distributed manufacturing

A technology of artificial intelligence and accelerometer, applied in the field of electronics, can solve problems such as difficulty in satisfying users, high transportation costs, and few product models, and achieve the effects of personalized and intelligent manufacturing, high accuracy, and material saving

Pending Publication Date: 2020-11-27
NAT INST OF METROLOGY CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The entire design and manufacturing process is completed in a centralized place, with long production cycles, few product

Method used

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  • Accelerometer based on artificial intelligence design and distributed manufacturing
  • Accelerometer based on artificial intelligence design and distributed manufacturing
  • Accelerometer based on artificial intelligence design and distributed manufacturing

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Embodiment Construction

[0018] In order to make the above objectives, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0019] figure 1 It is a schematic diagram of the artificial intelligence design method and distributed manufacturing method of the present invention. The artificial intelligence design part is to first use a computer with powerful computing capabilities managed by a cloud platform to perform electrical simulation or finite element simulation on the electronic device model to obtain a large data set of one-to-one correspondence between the geometric parameters of the device and the response result. Then feed the large data sets to the two-way artificial intelligence network for training, and save the data and network parameters on the cloud computing platform after the training is completed. When in use, the user can inpu...

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Abstract

The invention discloses an accelerometer based on artificial intelligence design and distributed manufacturing. Big data sets in one-to-one correspondence between geometric parameters and response results of a device by using a simulation method; the big data sets are respectively fed into a bidirectional artificial intelligence network for training; a three-dimensional model is constructed according to the geometrical parameters obtained by the reverse retrieval; a three-dimensional printer which is controlled and managed by a cloud computing platform is used for manufacturing, and the cloudcomputing platform can provide various materials at the same time; a mechanical structure of the device is made of an insulating material; electrodes and leads of the device are manufactured by conductive materials to be interconnected, a temporary supporting structure of a three-dimensional structure is manufactured by sacrificial materials capable of being selectively removed, the supporting structure is selectively removed after integrated manufacturing is completed to obtain the complete device, the design and manufacturing difficulty is lowered, the design and manufacturing period is shortened, and the personalized and intelligent manufacturing is achieved.

Description

Technical field [0001] The invention relates to the field of electronic technology, in particular to an artificial intelligence design method and a distributed manufacturing method of an accelerometer. Background technique [0002] Electronic sensors such as accelerometers, pressure sensors, gyroscopes, etc. are widely used in industrial production and people's daily lives. The design of these sensors is usually done by technicians with professional knowledge, usually isolated modeling and simulation, once the geometric size is modified, it must be re-modeled, which usually takes several weeks, and it is difficult to write analytical reverse design problems. That is, it is often difficult to effectively solve the geometric parameters according to the response results of the device. The manufacturing methods of these sensors are usually based on silicon-based microelectronic processes such as deposition, photolithography, etching, and metallization, which usually take several mon...

Claims

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Application Information

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IPC IPC(8): G06F30/17G06F30/20G06T17/00
CPCG06T17/00G06F30/17G06F30/20
Inventor 刘冠东贾志立
Owner NAT INST OF METROLOGY CHINA
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