A detection method for high multi-layer board circuit and electric milling accuracy

Abstract

The invention discloses a detection method for high multi-layer board circuit and electric milling accuracy, comprising the following steps: S1. Installing monitoring equipment, the monitoring equipment includes a collection camera and a display, and the collection camera and the display are electrically connected; S2 , Install a circuit main board, the circuit main board includes six or more layers of circuit boards, the top and bottom circuit boards are signal layers, and each interval layer of the circuit main board is respectively provided with a power supply layer and a ground layer; S3, set the circuit section State; S4, electric milling Kebang; the present invention provides a detection method for high multi-layer board circuit and electric milling accuracy, by setting a camera and a display, and cooperating with the settings of the circuit Kebang and the electric milling Kebang, the corresponding point Increase the spacing between the layers along a certain rule, observe the offset of the hole and the pattern by monitoring, and cooperate with the detection tool to measure the variation, so as to effectively ensure the accuracy of the line and electric milling, and the operation is simple and fast, thus ensuring the High multi-layer circuit board withstand voltage target.

Description

technical field [0001] The invention belongs to the technical field of circuit detection, and more particularly, relates to a detection method for high multi-layer board circuit and electric milling precision. Background technique [0002] A printed circuit board (PCB), also known as a printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Printed circuit boards can be divided into single-sided, double-sided, four-layer, six-layer and other multi-layer circuit boards according to the number of circuit boards. [0003] For multi-layer printed circuit boards, the detection of interlayer dislocation is a necessary detection step, which is also generally called printed circuit board alignment detection. In the prior art, a multimeter is generally used for alignment detection. Since each plate is designed with two alignment Colback, to reflect the alignment of the plate....

AI Technical Summary

Problems solved by technology

However, since a Colback has a total of 9 measurement points of 3mil, 3.5mil...6.5, 7mil, when the alignment of the board is 7mil, a Colback needs to be measured 9 times with the traditional measurement method

And when recording data after measurement, you need to put down the red and black test leads of the multimeter first, and repeatedly take and detect the operation when continuing to measure, so the detection is inconvenient and time-consuming, and it is not conducive to ensuring the accuracy of the circuit and the accuracy of the electric milling, so it cannot be guaranteed Withstand voltage target