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Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate and printed wiring board

A technology of resin composition and metal foil, applied in the field of resin composition containing resin and inorganic filler

Pending Publication Date: 2020-11-27
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The thermally conductive resin composition of Patent Document 1 certainly has improved thermal conductivity, but there is still room for improvement in its other properties

Method used

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  • Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate and printed wiring board
  • Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate and printed wiring board
  • Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate and printed wiring board

Examples

Experimental program
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Effect test

Embodiment Construction

[0127] Next, the present disclosure will be specifically described through illustrative examples. Note that these embodiments are only examples of the present disclosure, and should not be construed as limiting.

[0128] [Material]

[0129] The following materials were used as materials for the resin compositions according to specific examples and comparative examples.

[0130] (resin as component (A))

[0131] Bisphenol A liquid epoxy resin, product number "850-S", produced by DIC Corporation;

[0132] Naphthalene epoxy resin, product number "HP-4710", manufactured by DIC Corporation;

[0133] Naphthalene liquid epoxy resin, product number "HP-4032D", produced by DIC Corporation;

[0134] · Trifunctional epoxy resin, product number "VG3101L", manufactured by Printec Corporation; and

[0135] • Phenoxy resin, product number "YP-50", manufactured by Nippon Steel & Sumitomo Metal Chemical Corporation.

[0136] (Inorganic filler as component (B))

[0137] (anhydrous magnes...

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Abstract

A resin composition according to the present invention contains (A) a resin and (B) an inorganic filler. The component (B) contains (b1) anhydrous magnesium carbonate and (b2) aluminum oxide. The content of the component (b1) is within the range of from 35% by volume to 65% by volume (inclusive) relative to 100% by volume of the total of the component (b1) and the component (b2). The content of the component (B) is within the range of from 60% by volume to 75% by volume (inclusive) relative to 100% by volume of the resin composition.

Description

technical field [0001] The present disclosure generally relates to a resin composition, a resin film, a metal foil sheet with a resin, a prepreg, a metal-clad laminate, and a printed wiring board, and more particularly to a resin composition containing a resin and an inorganic filler, a resin Films, metal foil sheets with resins, prepregs, metal-clad laminates and printed wiring boards. Background technique [0002] Patent Document 1 discloses a thermally conductive resin composition. The thermally conductive resin composition contains two or more inorganic fillers (including at least a first inorganic filler and a second inorganic filler), and the total content of the inorganic fillers is in the range of 60% by mass to 95% by mass. The Mohs' hardness of the first inorganic filler is 4 or more, and the Mohs' hardness of the second inorganic filler is 3 or less. In addition, the ratio of the first inorganic filler to the second inorganic filler is in the range of 1:1 to 1:0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00B32B15/08C08J5/24C08K3/22C08K3/26H05K1/03
CPCB32B15/08C08K3/22C08K3/26C08L101/00H05K1/03C08J5/24H05K1/0373H05K3/022H05K2201/0209C08J7/0427C08J2363/00C08J2463/00B32B2457/08B32B15/20B32B2307/206B32B15/14B32B5/022B32B2307/538B32B2260/046B32B2260/021B32B2307/732B32B2262/101C08K9/02C08K2003/2227C08K2003/267C08K2201/005C08J5/244C08J5/249C08L63/00H01L23/3737H05K7/20472
Inventor 山内章裕齐藤英一郎青木幸一
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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