Pressing plate structure of integrated circuit packaging wire welding machine

Abstract

The invention discloses a pressing plate structure of an integrated circuit packaging wire welding machine. The pressing plate structure of the integrated circuit packaging wire welding machine comprises a connecting plate, an extension plate, a mounting hole, a heat dissipation hole, a check block, a pressing plate, a groove, first positioning holes, limiting blocks, a fixing block, a rubber layer, a threaded rod, a positioning plate, side plates, sleeve blocks, second positioning holes, motors, fixing rods, a connecting rod, a supporting plate, piston rods, a connecting pipe, a base plate, afirst clamping block, a protective shell, a second clamping block, heating blocks, trapezoidal receding grooves, a transverse strip, a vertical plate, a fixing plate, guide grooves, guide wheels, clamping supports, anti-skid blocks and transverse shafts. The extension plate and the limiting blocks are beneficial to installation of the whole device, and the side plates and the positioning plate can automatically position a to-be-machined workpiece; the first clamping block facilitates installation of the heating blocks, the piston rods can adjust the height of the supporting plate below the pressing plate, the heating block facilitates auxiliary tin wire melting, and the welding effect is improved; and the guide grooves and the trapezoid receding grooves are beneficial to placement and movement of a lead frame, and the fixing plate and the guide wheels can guide movement of the lead frame.

Description

technical field [0001] The present application relates to a press plate structure of a wire bonding machine, in particular to a press plate structure of an integrated circuit packaging wire bonding machine. Background technique [0002] Wire bonding machines include gold wire machines, aluminum wire machines, and ultrasonic wire bonding machines. Generally, gold wire machines mostly use ASM copper wire welding. At present, KS’s CONNX machine has the most efficiency in the market. The wire welding machine is mainly used in high-power devices: light-emitting diodes (LEDs), laser tubes (lasers), small and medium-sized power triodes, Inner lead welding of integrated circuits and some special semiconductor devices. [0003] Generally, when the integrated circuit is packaged and bonded, the workpiece to be processed cannot be automatically positioned when placed on the pressure plate, and the position needs to be manually adjusted. The operation is more troublesome, which is not ...

AI Technical Summary

Problems solved by technology

[0003] Generally, when the integrated circuit is packaged and bonded, the workpiece to be processed cannot be automatically positioned when placed on the pressure plate, and the position needs to be manually adjusted. The operation is more troublesome, which is not conducive to the bonding of the workpiece. When bonding the LED, it lacks a heating structure. It is not conducive to the melting of tin wire, which may affect the welding effect, and it needs to be used with the lead frame when welding the integrated circuit package. The bottom of the pressure plate lacks a guiding structure, which is not conducive to the movement and guidance of the lead frame, and affects the efficiency of workpiece processing

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