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Merging equipment for semiconductor graphite production and processing and merging method thereof

A semiconductor and graphite technology, which is applied to the combined equipment and combined fields of semiconductor graphite production and processing, can solve the problems of inability to meet the continuity of subsequent processing, difficult to ensure uniform spacing between graphite sheets, affecting speed and efficiency, etc., so as to improve speed and efficiency. , Improve the speed of pressing and increase the effect of stability

Inactive Publication Date: 2020-12-04
DATONG XINCHENG NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is difficult to ensure the uniform spacing between graphite sheets by manual placement. If the spacing is not uniform, it will cause discontinuity in subsequent die-cutting, affecting speed and efficiency, and cannot meet the continuity of subsequent processing.

Method used

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  • Merging equipment for semiconductor graphite production and processing and merging method thereof
  • Merging equipment for semiconductor graphite production and processing and merging method thereof
  • Merging equipment for semiconductor graphite production and processing and merging method thereof

Examples

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Effect test

Embodiment 1

[0032] Embodiment 1: In order to solve the problem that the graphite sheet feeding time interval is not uniform, and improve the speed and efficiency of graphite sheet processing and merging, a merging device for semiconductor graphite production and processing is proposed in this embodiment, see Figure 1-6 , including base plate 1, support assembly, conveyor belt 23, feeding assembly, unloading assembly, and pressing mechanism. The base plate 1 is a rectangular plate placed horizontally and horizontally. Seats 11 are located on the inner side of each support seat 11 and are provided with support components on the bottom surface of the base plate 1. The four corners of the top surface of the base plate 1 are provided with vertically placed fixing plates 2, and the top of each fixing plate 2 is installed There are bearings, a pair of longitudinally placed roller shafts 21 are provided at both ends of the top surface of the bottom plate 1, and the two ends of each roller shaft 2...

Embodiment 2

[0037] Example 2: see Figure 7 , in the present embodiment, the present invention also proposes the merging method of the merging equipment for the production and processing of semiconductor graphite, comprising the following steps:

[0038] Step 1, each electrical component is connected to an external power supply, and the supporting electric push cylinder 14, the first telescopic cylinder 42, the second telescopic cylinder 44, and the motor 3 are respectively electrically connected to the external power supply through the power line;

[0039] Step 2, move the device through the support assembly and fix it, control the extension of the electric push rod supporting the electric push cylinder 14, and drive the support slide plate 13 to slide down along the support slide rod 15 through the electric push connecting block, due to the support spring 16 tension effect, the support spring 16 stretches and becomes longer, and then reversely drives the movable wheel 17 to contact the ...

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Abstract

The merging equipment comprises a bottom plate, supporting assemblies, a conveying belt, a feeding assembly, a discharging assembly and a pressing mechanism, the bottom is located on the inner side ofeach supporting base, the supporting assemblies are arranged on the bottom surface of the bottom plate, each roller shaft is sleeved with a roller, and the front end and the rear end of the conveyingbelt are sleeved with the corresponding rollers correspondingly; a feeding assembly is installed on the bottom plate and located at the front end of the transmission belt, and a discharging assemblyis installed on the bottom plate and located at the rear end of the transmission belt. A pair of vertical plates is longitudinally arranged on the top face of the bottom plate and located on the two sides of the middle of the transmission belt, and a pressing mechanism is installed between the two vertical plates. The invention further discloses a merging method of the merging equipment for semiconductor graphite production and processing. According to the equipment, the problem that graphite flake feeding time intervals are not uniform is solved, through cooperative use of all mechanism assemblies, tedious operation steps are simplified, pressing forming of graphite flakes is facilitated, the graphite flake machining and combining speed is increased, and the graphite flake machining and combining efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of graphite processing equipment, in particular to a merging device for semiconductor graphite production and processing and a merging method thereof. Background technique [0002] The production of synthetic graphite is generally formed by pressing graphite sheets and release films together. In the existing production of synthetic graphite, the placement of graphite flakes on the feeder is realized by manual operation. Manual placement is difficult to ensure uniform spacing between graphite sheets. If the spacing is not uniform, subsequent die-cutting will be interrupted, affecting speed and efficiency, and cannot meet the continuity of subsequent processing. Contents of the invention [0003] The object of the present invention is to solve the shortcoming existing in the prior art, and propose the combined equipment for the production and processing of semiconductor graphite. [0004] In order to achie...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B37/00B65G47/18B65G15/58B65G47/34
CPCB32B37/10B32B37/0046B65G47/18B65G15/58B65G47/34
Inventor 郭志宏张培林武建军柴利春张作文王志辉
Owner DATONG XINCHENG NEW MATERIAL CO LTD
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