Linear hydrodynamic pressure polishing waviness prediction optimization method

A technology for prediction optimization and waviness, applied in prediction, design optimization/simulation, instruments, etc., to achieve the effect of reducing pre-processing experiments

Pending Publication Date: 2020-12-04
ZHEJIANG UNIV OF TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Experimental research shows that linear hydraulic polishing has considerable material removal rate and processing uniformity. However, the grinding wheel-like processing method makes surface waviness a processing difficulty that cannot be ignored.

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  • Linear hydrodynamic pressure polishing waviness prediction optimization method
  • Linear hydrodynamic pressure polishing waviness prediction optimization method

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Embodiment Construction

[0059] In order to illustrate the embodiments of the present invention more clearly, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other accompanying drawings based on these drawings and obtain other implementations.

[0060] Such as Figure 1-4 As shown, the linear hydrodynamic polishing waviness prediction and optimization method of the embodiment of the present invention includes the following steps:

[0061] S1. Analyze the parameters related to the waviness of linear hydraulic polishing, and conduct single-factor pre-experiments respectively to explore the influence rules and response sensitivity of each parameter;

[0062] Specifically, according to the theory of dynamic lubrication, hydrodynamic pressure and shear force are the tw...

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Abstract

The invention relates to a linear hydrodynamic pressure polishing waviness prediction optimization method which comprises the following steps: S1, analyzing parameters related to linear hydrodynamic pressure polishing waviness, respectively carrying out single-factor experiments, and exploring influence rules and response sensitivity of the parameters; S2, significant parameters being screened toserve as test factors, waviness serving as test output, and interaction between the parameters being analyzed through a response surface method; S3, establishing a linear hydrodynamic pressure polishing waviness prediction model based on a support vector regression machine SVR by taking the response surface design test group as a sample training set, so that the waviness under an unknown sample can be accurately predicted; and S4, taking the established optimal SVR prediction model as a fitness function, taking a genetic algorithm GA as an optimization model of a global optimization tool, andobtaining an optimal parameter combination for controlling the linear hydrodynamic pressure polishing waviness. By means of the linear hydrodynamic polishing waviness prediction optimization method, the machining capacity of linear hydrodynamic polishing is further improved.

Description

technical field [0001] The invention belongs to the technical field of research on the change law of surface waviness, and in particular relates to a method for predicting and optimizing waviness of linear hydraulic polishing. Background technique [0002] Linear hydrodynamic polishing is a new type of non-contact polishing based on the theory of dynamic lubrication. During the polishing process, the polishing tool and the workpiece are in a non-contact state, and there are several micro-groove structures evenly distributed on the circumference of the polishing roller, which rotate at high speed. The polishing roller brings the polishing liquid into the convergence gap of the micro-groove structure, forming a uniformly distributed dynamic pressure liquid film, relying on the dynamic pressure field and shear field in the liquid film to drive the polishing liquid nano-abrasive particles to hit the surface of the workpiece, and realize the atomization of the workpiece to be poli...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/27G06F30/20G06K9/62G06Q10/04G06F111/04G06F113/08
CPCG06F30/27G06F30/20G06Q10/04G06F2111/04G06F2113/08G06F18/214
Inventor 文东辉许鑫祺淦作昆胡振扬陈嘉琦
Owner ZHEJIANG UNIV OF TECH
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