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Full-automatic film sticking machine for wafer

A fully automatic, laminating machine technology, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low lamination efficiency and unguaranteed quality, and achieve the effect of improving lamination efficiency and quality

Pending Publication Date: 2020-12-15
开异智能技术(上海)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Wafers need to be laminated multiple times in the processing engineering to avoid damage. At present, most wafer processing factories use manual or semi-automatic methods to carry out film lamination operations. The efficiency of film lamination is low and the quality cannot be guaranteed.

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  • Full-automatic film sticking machine for wafer
  • Full-automatic film sticking machine for wafer

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Embodiment Construction

[0013] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0014] Such as Figure 1 to Figure 2 As shown, the wafer automatic film mounter of the present invention includes a frame 1, a wafer positioning mechanism 2 and a wafer lifting mechanism 3 are arranged on the left side of the frame 1, and a wafer positioning mechanism 2 is provided with a The wafer carrier 4, the wafer lifting mechanism 3 is in front of the wafer positioning mechanism 2, and the right side of the rack 1 is provided with an adsorption positioning mechanism 5, a rotary die-cutting mechanism 6, a wafer transfer mechanism 7 and a film feeding mechanism 8; put the wafer together with the wafer carrier 4 into the wafer positioning mechanism 2 for positioning an...

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Abstract

The invention relates to the technical field of wafer processing accessory devices, in particular to a full-automatic film sticking machine for a wafer, which realizes full-automatic film sticking andimproves the film sticking efficiency and quality. The film sticking machine comprises a rack, wherein a wafer positioning mechanism and a wafer lifting mechanism are arranged on the left side of therack, a wafer carrier used for placing a wafer is arranged at the wafer positioning mechanism, the wafer lifting mechanism is located in front of the wafer positioning mechanism, and an adsorption positioning mechanism, a rotary die cutting mechanism, a wafer transferring mechanism and a film feeding mechanism are arranged on the right side of the rack.

Description

technical field [0001] The invention relates to the technical field of wafer processing attachments, in particular to a wafer automatic film mounter. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8-inch and 12-inch. [0003] Wafers need to be laminated multiple times during processing to avoid damage. Most wafer processing factories now use manual or semi-automatic methods for film lamination, which has low film lamination efficiency and cannot guarantee quality. Contents of the invention [0004] In order to solve the above-mentioned technical problems, th...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67132
Inventor 彭文学郑振平钟贤青刘秀东慎厚清
Owner 开异智能技术(上海)有限公司