Plastic package type triode and manufacturing process
A triode and V-shaped groove technology, which is applied in the direction of transistors, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of lowering work efficiency, lowering the safety of using triodes, and low practicability, so as to improve heat dissipation performance, avoiding overheating and burning, and improving practicality
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] see Figure 1-7, the present invention provides a technical solution: a plastic-encapsulated triode, including a triode main body 1, a first heat sink 2, a first fixing plate 3, a first fixing rod 4, a second fixing rod 5, and a first V-shaped groove 6 , the first pin 7, the second pin 8, the second V-shaped groove 9, the third pin 10, the third V-shaped groove 11, the mounting plate 12, the dust cover 13, the second heat sink 14, the movable plate 15....
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