Plastic package type triode and manufacturing process

A triode and V-shaped groove technology, which is applied in the direction of transistors, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve the problems of lowering work efficiency, lowering the safety of using triodes, and low practicability, so as to improve heat dissipation performance, avoiding overheating and burning, and improving practicality

Active Publication Date: 2020-12-15
东莞市柏尔电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The triode has many functions. Generally, it is connected to the circuit and used as a current amplifier. The triode has a certain resistance, so heat will be generated when the current passes through. If the heat is not dissipated in time, the work efficiency will be reduced, and it will even cause the triode to burn out, which will affect the circuit. It is safe to use, and the environment in which the triode is installed is relatively complicated. A large amount of dust in the air will gather on the triode. The use of the triode is safe. At the same time, after the triode is installed in the circuit, the excess part needs to be cut off, and special tools are needed to cut it, so the practicability is relatively low.

Method used

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  • Plastic package type triode and manufacturing process
  • Plastic package type triode and manufacturing process
  • Plastic package type triode and manufacturing process

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0032] see Figure 1-7, the present invention provides a technical solution: a plastic-encapsulated triode, including a triode main body 1, a first heat sink 2, a first fixing plate 3, a first fixing rod 4, a second fixing rod 5, and a first V-shaped groove 6 , the first pin 7, the second pin 8, the second V-shaped groove 9, the third pin 10, the third V-shaped groove 11, the mounting plate 12, the dust cover 13, the second heat sink 14, the movable plate 15....

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Abstract

The invention discloses a plastic package type triode and a manufacturing process. The triode comprises a triode body, a first cooling fin, a first fixing plate, a first fixing rod, a second fixing rod, a first V-shaped groove, a first pin, a second pin, a second V-shaped groove, a third pin, a third V-shaped groove, a movable plate, a locking rod, a first through hole, a locking block, a second through hole, a first fixing block, a fixing shaft, a connecting groove, a mounting groove, a fixing ring, a spring, a limiting block and a guide rod. Through installation of the dustproof cover, the phenomenon that the triode body is burnt down due to the fact that dust absorbs moisture in air is avoided, through clamping connection of the locking block and the first through hole in the movable plate, the dustproof cover is rapidly put down and put away, and through installation of a first cooling fin and a second cooling fin, the cooling performance of the device is improved. By forming the first V-shaped groove, the second V-shaped groove and the third V-shaped groove, manual breaking of the first pin, the second pin and the third pin is achieved.

Description

technical field [0001] The invention relates to the technical field of triodes, in particular to a plastic-encapsulated triode and a manufacturing process. Background technique [0002] Triode, the full name should be semiconductor triode, also known as bipolar transistor, crystal triode, is a semiconductor device that controls current. Its function is to amplify the weak signal into an electrical signal with a large amplitude value, and it is also used as a non-contact switch. The triode is one of the basic components of semiconductors. It has the function of current amplification and is the core component of the electronic circuit. The triode is made on a semiconductor substrate with two PN junctions that are very close to each other. The two PN junctions divide the whole semiconductor into three parts. The middle part is the base area, and the two sides are the emitter area and the collector area. The arrangement is PNP And NPN two kinds. [0003] The triode has many fu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/04H01L23/367H01L23/48H01L29/73H01L21/56
CPCH01L23/3107H01L23/04H01L23/3672H01L23/48H01L29/73H01L21/561
Inventor 夏小明
Owner 东莞市柏尔电子科技有限公司
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