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4results about How to "Avoid burning phenomenon" patented technology

A method, apparatus, device, and storage medium for stall protection of an electric drive system.

This invention discloses a stall protection method, device, equipment, and storage medium for an electric drive system. The scheme may include: acquiring the initial temperature of the IGBT module in the motor controller and the starting torque of the motor when the motor enters the starting state; defining a number of time nodes sequentially, with the moment when the motor enters the starting state as the zero point; for the number of time nodes, provided that the empirical temperature rise value of the IGBT module is less than the temperature rise margin, if it is detected that there is no time node in the number of time nodes where the actual speed of the motor exceeds the speed threshold of the motor in the running state, then if the torque of the motor is not zero, the starting state of the motor is maintained; if the torque of the motor becomes zero, the shutdown mode is entered; when it is detected that the empirical temperature rise value of the IGBT module corresponding to a second time node in the number of time nodes is greater than or equal to the temperature rise margin for the first time, the stall condition of the motor is reported, and the motor is shut down.
Owner:CHANGZHOU ECTEK AUTOMOTIVE ELECTRONICS LTD

Packaging structure, circuit structure and packaging method of electronic fuse

ActiveCN116722005BAvoid burning phenomenonImprove cooling effect
The application discloses a packaging structure of an electronic fuse, a circuit structure and a packaging method thereof. The packaging structure comprises a packaging frame with a frame base and a plurality of pins, a MOS chip above the frame base, a metal connecting piece above the MOS chip and a controller chip above the metal connecting piece. The MOS chip comprises a main MOS tube and a branch MOS tube. The metal connecting piece completely covers the source area of the main MOS tube and is adapted to connect the source area of the main MOS tube with the pins of the packaging frame. The source area of the branch MOS tube is directly connected with the pins of the packaging frame. The controller chip is adapted to only open the main MOS tube during the soft start of the electronic fuse and to open the branch MOS tube after the soft start is completed or after the main MOS tube enters a linear region. The above scheme can reduce the burning of the MOS tube.
Owner:WUXI CHIPOWN MICROELECTRONICS

Glass forming line electric heating structure

The utility model discloses a glass forming line electric heating structure which comprises a mounting base, a motor is fixedly connected to the top of the mounting base, a transmission rod is fixedly connected to the output end of the motor, the transmission rod penetrates through the mounting base and is rotationally connected with the mounting base, a plurality of stirring rods are fixedly connected to the outer wall of the transmission rod, and the stirring rods are fixedly connected to the outer wall of the transmission rod. The device comprises a mounting base, two L-shaped rods are fixedly connected to the bottom of the mounting base, each L-shaped rod is fixedly connected with a heating copper plate, two T-shaped rods rotationally connected with the mounting base are arranged on the mounting base in a penetrating mode, the outer walls of the two T-shaped rods are jointly sleeved with a belt, and a clamping mechanism is arranged on each T-shaped rod. The heating copper plate is adopted to replace an aluminum plate, so that the burning loss phenomenon is avoided, and the voltage and the current of a circuit connected with the heating copper plate are stable; the device can be installed in a heating furnace through the clamping mechanism, and the device can be taken out in time to be overhauled.
Owner:SHOUGUANG XINSHUO MATERIAL TECH CO LTD

Failure analysis sample treatment method and failure analysis method

The invention provides a failure analysis sample treatment method and a failure analysis method.The failure analysis sample treatment method comprises the steps that a test sample is delaminated to a first metal layer, and a complete test structure is reserved; grounding the test sample, and conducting away charges on the surface of the first metal layer; pre-positioning the failure position of the test sample; grinding the test sample to be above the second metal layer, and plating a conductive layer on the ground surface of the test sample; and a failure position is positioned, and a mark is formed. According to the configuration, the test sample is ground to the second metal layer, and the conductive layer is plated on the surface of the test sample, so that charges accumulated on the surface of the test sample can be conducted away in time, the phenomenon that a metal wire is burnt down due to charge accumulation is avoided, the original morphology of a failure position can be reserved, and a failure reason can be found more accurately; and the conducting layer does not influence the observation of an SEM machine and a TEM machine, so that the success rate of failure analysis is improved, and the cost of failure analysis is reduced.
Owner:SHANGHAI HUALI INTEGRATED CIRCUIT CORP