Multilayer LCP circuit board

A circuit board and copper clad laminate technology, applied in the field of multi-layer LCP circuit boards, can solve the problems of easy occurrence of air bubbles, product deformation, and high fluidity of the substrate, so as to release the pressing stress, reduce the expansion and shrinkage deformation, and improve the good quality. rate effect

Inactive Publication Date: 2020-12-15
RUISHENG NEW ENERGY DEV CHANGZHOU +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When LCP is pressed, the transition temperature from highly elastic state to viscous flow state is high, and the fluidity of the base material is relatively high, which easily causes product deformation and bubbles, which affects product quality.

Method used

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  • Multilayer LCP circuit board
  • Multilayer LCP circuit board
  • Multilayer LCP circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0019] figure 1 It is a structural schematic diagram of a multi-layer LCP circuit board according to an embodiment of the present invention, please refer to figure 1 The multi-layer LCP circuit board 100 includes a first LCP copper-clad laminate 10 , at least one second LCP copper-clad laminate 20 and a third LCP copper-clad laminate 30 which are stacked in sequence and bonded without glue.

[0020] In this embodiment, when multiple second LCP copper-clad laminates 20 are provided, the multiple second LCP copper-clad laminates 20 have the same structure and are stacked sequentially. In one embodiment, see figure 1 , the second LCP CCL 20 set one, see figure 1 and figure 2 , the second LCP copper clad laminate 20 includes a second LCP layer 21 and a second copper foil layer 22 laminated with the second LCP layer 21 .

[0021] Further, see figure ...

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PUM

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Abstract

The invention provides a multilayer LCP circuit board which comprises a first LCP copper-clad plate, at least one second LCP copper-clad plate and a third LCP copper-clad plate which are sequentiallystacked and laminated without glue, the second LCP copper-clad plate comprises a second LCP layer and a second copper foil layer laminated with the second LCP layer, and the second copper foil layer comprises a product molding area and a waste area surrounding the product molding area. A plurality of honeycomb structures are etched in the waste area, and the etched edges of the honeycomb structures are communicated with one another. According to the multilayer LCP circuit board, the honeycomb structure is etched in the waste area through the LCP copper-clad plate on the inner layer, meanwhile,the etched edges of the honeycomb structure are communicated with one another, bubbles generated when a product is pressed can be effectively discharged, meanwhile, the honeycomb structure is beneficial for releasing pressing stress and reducing expansion and contraction deformation of the product, and therefore the yield of the product is increased.

Description

【Technical field】 [0001] The invention relates to the technical field of circuit board production, in particular to a multilayer LCP circuit board. 【Background technique】 [0002] With the rapid development of electronic technology, circuit board design tends to be more and more high-precision and high-density. In order to obtain more wiring space or when copper foil is required for ground shielding, double-sided or multi-layer boards are required. Liquid crystal polymer resin (LCP, Liquid Crystal Polymer for short) microwave dielectric substrate material has high heat resistance, low water absorption, low dielectric loss, and high dimensional stability, and is an ideal material for 5G high-frequency signal transmission. [0003] However, at present, when the printed circuit board with LCP as the base material is laminated without glue on the LCP copper clad laminate, the inner layer circuit is produced through the processes of exposure, development and etching, and the cop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K3/46
CPCH05K1/0313H05K3/4611H05K3/4697
Inventor 计美阳陈勇利韩佳明
Owner RUISHENG NEW ENERGY DEV CHANGZHOU
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