Air supply systems and grinding tools for air bearings

Abstract

The invention discloses an air supply system and a grinding tool for an air bearing. The air supply system includes a main air source, a backup air source, a relay valve, an air control valve, a first filter, a second filter, a drying The main air source is connected with the pre-control port, the air source port of the relay valve and the first air inlet port of the air control valve at the same time, and the output port of the relay valve is connected with the control port of the air control valve. The air outlet of the control valve communicates with the air pipe interface of the air bearing through the first filter, the second filter, the dryer and the pressure reducing valve in sequence, so that when the air supply pressure of the main air source is greater than or equal to the preset pressure, the relay valve The air source port is connected with the output port so that the first air inlet of the air control valve is connected with the air outlet to realize the main air source supplying air to the air bearing, and the backup air source is connected with the second air inlet of the air control valve to When the main air source fails and the air supply pressure is lower than the preset pressure, the second air inlet of the air control valve is connected to the air outlet to automatically switch to the backup air source to supply air to the air bearing.

Description

technical field [0001] The invention belongs to the technical field of wafer ultra-precision grinding, and in particular relates to an air supply system and a grinding tool for an air bearing. Background technique [0002] At present, the semiconductor industry manufactures semiconductor chips by forming electronic circuits such as IC (Integrated Circuit) or LSI (Large Scale Integration) on the surface of semiconductor wafers. Before the wafer is divided into semiconductor chips, the wafer is ground to a predetermined thickness by grinding the back surface of the wafer opposite to the device surface on which the electronic circuit is formed. [0003] In semiconductor ultra-precision grinding equipment, the grinding wheel spindle for grinding wafers mostly uses air bearings. Air bearings are also called air bearings, which refer to sliding bearings that use gas as a lubricant. An air film is formed between them to achieve frictionless relative rotation between the shaft and ...

AI Technical Summary

Problems solved by technology

The speed of the grinding wheel spindle reaches thousands of revolutions during the grinding movement. Once the air supply system of the air bearing is cut off, it will take a certain time for the motor to brake, and the bearing and the rotating shaft will inevitably rub against each other, resulting in loss of precision between the bearing and the rotating shaft. Caused by occlusal lock, it is a serious accident

[0005] The air supply pressure of the air bearing is generally 0.2MPa~0.6MPa. Different manufacturers have different air supply requirements. Generally, the recommended air supply pressure is 0.5MPa; It will decrease in proportion to the air supply pressure; when the air source pressure is lower than the specified value, the insufficient load capacity of the bearing will cause the air bearing to malfunction or even be damaged, resulting in equipment shutdown and huge economic losses. Therefore, ensure the air supply of the air bearing The stability of the

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