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Method for installing semiconductor element on substrate

An assembly method and semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as unreliable connection, circuit damage, open circuit, etc., to solve edge leakage and effective effect. Effect

Inactive Publication Date: 2003-09-10
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These locations of large particle density may cause damage to the circuit as the connection area of ​​the semiconductor chip 103
[0013] In addition, the conductive particles 106 function as an electrical connection between the bump 102 and the flexible substrate 101, but the non-uniformity of the conductive particles 106 increases the connection resistance, or increases an unreliable connection, and in the worst case, causes open circuit

Method used

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  • Method for installing semiconductor element on substrate
  • Method for installing semiconductor element on substrate
  • Method for installing semiconductor element on substrate

Examples

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Embodiment Construction

[0029] Refer below Figure 4A to Figure 4D An embodiment of the present invention will be described. Figure 4A to Figure 4D is a diagram showing the process steps of the semiconductor device mounting method according to the present invention. and Figure 1A to Figure 1D Elements of the prior embodiment shown have elements with the same function and are designated by the same reference numerals.

[0030] Such as Figure 4A As shown, in this embodiment, a semiconductor chip 103 having bumps 102 made of gold is mounted on a flexible substrate 101 on which a conductor pattern 100 is formed. The insulating material in the flexible substrate 101 is made of polyimide or polyester, the conductor pattern 100 is made of copper, and the surface of the copper is tin-plated.

[0031] Wherein, the tin plating thickness of the conductor pattern 100 is 0.1-5 μm, and the height of the protrusion is 5-50 μm.

[0032] Such as Figure 4B As shown, first, the resin film 1 is coated on the su...

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Abstract

A semiconductor element / substrate mounting structure is formed by a first step of covering a resin film over the substrate together with a conductive portion; a second step of pressing and heating so that bumps penetrate through the resin film to come into contact with the conductive portion; and a third step of pressing and heating so that the bumps and the conductive portion become alloyed between the semiconductor element and the substrate.

Description

technical field [0001] The present invention relates to a member for assembling a semiconductor element on a substrate and an assembling method thereof, in particular to a member for assembling the following semiconductor element on a substrate and an assembling method thereof, wherein a semiconductor element (chip) having a bump is placed Assembled to conductive parts such as flexible substrates. Background technique [0002] refer to Figure 1A to Figure 1D , describing the prior art. Figure 1A to Figure 1D A process diagram showing a method of mounting a semiconductor element in a conventional example. [0003] Such as Figure 1A As shown, a semiconductor chip 103 having bumps 102 made of gold is mounted on a flexible substrate 101 having a conductor pattern 100 as a conductive portion. Here, the surface of the conductor pattern 100 is plated with tin. As for the number of these bumps, if the semiconductor chip is used as an IC (Integrated Circuit), the number corresp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L21/60H05K3/32H05K13/04
CPCH01L2224/73203H01L2924/0105H01L2924/01004H01L2224/83101H01L2224/81801H01L2224/16H01L2224/13144H01L2924/01029H01L2224/29111H01L2924/0132H01L2224/83192H01L21/563H01L2224/83102H01L2924/014H01L2924/01013H01L2224/32225H01L2224/2919H01L2224/92125H01L24/81H01L2224/73204H01L2924/01079H01L2924/0104H01L2924/14H01L24/83H01L2924/1579H01L24/29H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/01078H01L2924/01075H01L2224/16225H01L2224/81Y10T29/49144Y10T29/49146H01L2924/00H01L2924/00015H01L2924/0665
Inventor 山本诚一
Owner SHARP KK