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Residual glue removing method

A technology of residual glue and after cleaning, which is applied in the field of semiconductor preparation and can solve problems such as difficult removal of residual glue on the substrate

Pending Publication Date: 2020-12-22
泉意光罩光电科技(济南)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a method for removing residual glue, which can effectively improve the defect that the residual glue on the substrate is not easy to remove

Method used

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  • Residual glue removing method
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  • Residual glue removing method

Examples

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no. 1 example

[0034] Please refer to figure 1 , the present embodiment provides a method for removing residual glue, which is used to clean the residual glue on the substrate, and the method for removing residual glue includes the following steps:

[0035] S100 , performing freezing treatment on the substrate to embrittle the residual glue adhering to the substrate.

[0036] It should be noted that this embodiment will take the residual glue attached to the substrate as an example to explain the removal of the residual glue. It does not mean that the residual glue removal method in this application is only applicable to the residual glue attached to the substrate. The adhesive residue removal method applied for can be applied to different types of boards, for example, various available semiconductor substrates such as touch screens and mask boards, or other applicable mechanical boards. The present application does not make a limitation here, and those skilled in the art can use it accordi...

no. 2 example

[0064] Please refer to Figure 4 , the present application also provides another method for removing residual glue. Compared with the first embodiment, the method for removing residual glue is different in that after removing the residual glue after cleaning in step S220, in order to further ensure that the residual glue attached to the substrate The glue is cleaned to keep the substrate clean, thereby ensuring the quality of semiconductor devices. This embodiment operates in the following manner.

[0065] Please refer to Figure 4 , after step S220, after removing the residual glue after cleaning, it also includes:

[0066] S300 , detecting whether there is any residual glue on the substrate.

[0067] If yes, clean the substrate again.

[0068] That is to say, in this embodiment, after the detection, when there is still glue residue on the substrate, return to step S210 to clean the substrate, so as to continue the cycle operation until there is no glue residue on the sub...

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Abstract

The invention discloses a residual adhesive removing method and relates to the technical field of semiconductor preparation. The residual glue removing method is used for cleaning residual glue on a substrate and comprises the following steps: subjecting the substrate to freezing treatment, and embrittling the residual glue attached to the substrate; removing the embrittled residual glue. According to the residual adhesive removing method, the residual adhesive can be embrittled and broken through freezing treatment, so that the characteristics of the residual adhesive are changed, adhesion with the surface of the substrate is removed, removal of the residual adhesive is facilitated, the defect that the residual adhesive on the substrate is not easy to remove can be effectively overcome, and the quality of a semiconductor device is also guaranteed to a certain extent.

Description

technical field [0001] The invention relates to the technical field of semiconductor preparation, in particular to a method for removing residual glue. Background technique [0002] In the semiconductor device manufacturing technology, it is usually necessary to pattern and etch the semiconductor substrate to form holes or grooves. Before etching, the surface of the semiconductor substrate must be coated with photoresist, so that the required The etching pattern is transferred to the etching substrate on the surface of the semiconductor structure, and the photoresist can be used as a mask to cover the area outside the etching area to protect the semiconductor substrate outside the etching area from being etched. During the etching process, the semiconductor substrate is etched into a desired pattern in a plasma environment, and the photoresist coated on the surface of the semiconductor substrate needs to be removed after the etching is completed. [0003] Among them, in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02G03F7/42
CPCH01L21/02057H01L21/02082G03F7/42
Inventor 张哲玮蔡奇澄贺遵火吴仕伟
Owner 泉意光罩光电科技(济南)有限公司