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Thin LED flash for camera

A technology of blue light and lighting system, applied in optics, optical components, instruments, etc., can solve the problem of lens thickness

Pending Publication Date: 2020-12-22
LUMILEDS HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a significant portion of the light escapes from the sides and is not reflected towards the object
Also, the prior art lens is relatively thick, resulting in a thick flash module

Method used

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  • Thin LED flash for camera
  • Thin LED flash for camera
  • Thin LED flash for camera

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] figure 1 is an exploded view of a flash module 10 in accordance with one embodiment of the present invention. Support substrate 12 may be a rigid substrate or a very thin flexible circuit. Using a flexible circuit as the support substrate 12 allows the module 10 to be thinner.

[0034] Metal traces 14 are patterned on substrate 12 to define metal pads 15 and 17 for the bottom anode and cathode electrodes of flip-chip LED die 16 and to define for an optional transient voltage suppressor (TVS) chip. 18 to the metal pads 19 and 21 of the electrodes.

[0035] A bare LED die 16 , such as a GaN-based blue LED die, is then electrically and thermally connected to substrate 12 . TVS chip 18 may also be electrically connected to substrate 12 .

[0036] Typically, LED die 16 is a flip-chip die, although other die types may be used, including those with bond wires. In order to minimize the thickness of the flash module 10 , the bottom electrodes of the LED dies are directly bo...

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PUM

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Abstract

A thin flash module for a camera uses a flexible circuit as a support surface. A blue GaN-based flip chip LED die is mounted on the flex circuit. The LED die has a thick transparent substrate forminga "top" exit window so at least 40% of the light emitted from the die is side light. A phosphor layer conformally coats the die and a top surface of the flex circuit. A stamped reflector having a knife edge rectangular opening surrounds the die. Curved surfaces extending from the opening reflect the light from the side surfaces to form a generally rectangular beam. A generally rectangular lens isaffixed to the top of the reflector. The lens has a generally rectangular convex surface extending toward the die, wherein a beam of light emitted from the lens has a generally rectangular shape corresponding to an aspect ratio of the camera's field of view.

Description

technical field [0001] The present invention relates to packaged phosphor-converted light emitting diodes (pcLEDs), and in particular to packaged pcLEDs useful as flashes for cameras. Background technique [0002] In modern digital cameras including smartphone cameras, it is common to provide flashes using pcLEDs. A common flash is a GaN-based blue LED die mounted in a round reflective cup on a rigid printed circuit board. A layer of YAG phosphor (emitting yellow-green) fills the cup. Since the LED die is very thin, almost all light is emitted from the top surface of the die. A circular Fresnel lens is then positioned over the cup to create a roughly conical light emission pattern (with circular cross-section) to illuminate the subject for photography. A cover plate forming part of the camera body typically has a circular opening for the lens. [0003] Since the camera's field of view is rectangular, much of the light emitted from a flash having a circular cross-section ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/58H01L33/50H01L25/075G03B15/05
CPCH01L33/58H01L33/60G03B2215/0567G02B7/105H01L33/502H01L33/486H01L33/505H01L33/507G03B15/05H01L33/501
Inventor M.M.巴特沃尔思
Owner LUMILEDS HLDG BV