Thin LED flash for camera
A technology of blue light and lighting system, applied in optics, optical components, instruments, etc., can solve the problem of lens thickness
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[0033] figure 1 is an exploded view of a flash module 10 in accordance with one embodiment of the present invention. Support substrate 12 may be a rigid substrate or a very thin flexible circuit. Using a flexible circuit as the support substrate 12 allows the module 10 to be thinner.
[0034] Metal traces 14 are patterned on substrate 12 to define metal pads 15 and 17 for the bottom anode and cathode electrodes of flip-chip LED die 16 and to define for an optional transient voltage suppressor (TVS) chip. 18 to the metal pads 19 and 21 of the electrodes.
[0035] A bare LED die 16 , such as a GaN-based blue LED die, is then electrically and thermally connected to substrate 12 . TVS chip 18 may also be electrically connected to substrate 12 .
[0036] Typically, LED die 16 is a flip-chip die, although other die types may be used, including those with bond wires. In order to minimize the thickness of the flash module 10 , the bottom electrodes of the LED dies are directly bo...
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