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A substrate type diffractive optical element vcsel light splitting structure and preparation method

A diffractive optical element and light-splitting technology, which is applied in the direction of optical elements, optics, electrical elements, etc., can solve problems such as difficulty in miniaturization

Active Publication Date: 2022-02-22
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the ToF method has high requirements on the transmitter and receiver, and has extremely high precision requirements for time measurement, and it is not easy to miniaturize the transmitting and receiving modules.

Method used

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  • A substrate type diffractive optical element vcsel light splitting structure and preparation method
  • A substrate type diffractive optical element vcsel light splitting structure and preparation method

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preparation example Construction

[0028] In view of certain limitations of ToF technology in the above background and the advantages and related principles of structured light technology in short-distance recognition, the present invention provides a substrate-type diffractive optical element VCSEL light-splitting structure and a preparation method.

[0029] Such as figure 1 As shown, the present invention provides a substrate-type diffractive optical element VCSEL light-splitting structure, which sequentially includes: a heat sink 1, a bottom-emitting VCSEL array chip 2, a substrate layer 3 with a binary diffraction grating 4, and a metasurface Structural layer 5, protective layer 6 and anti-reflection film layer 7; specifically:

[0030] The bottom of the bottom emission VCSEL array chip 2 is welded on the heat sink 1, the top of the bottom emission VCSEL array chip 2 is provided with a substrate layer 3, and the upper surface of the substrate layer 3 is etched with a binary diffraction grating 4 by a photol...

Embodiment

[0043] Specific implementation 1

[0044] The present invention provides a substrate-type diffractive optical element VCSEL spectroscopic structure, which sequentially includes: a heat sink 1, a bottom-emitting VCSEL array chip 2, a substrate layer 3 with a binary diffraction grating 4, and a metasurface structure layer 5 from bottom to top. , protective layer 6 and anti-reflection coating layer 7;

[0045] On the bottom emission VCSEL chip substrate layer 3 material surface etching binary diffraction grating 4 structure ( figure 2 ), specifically, bake the substrate pretreated with deionized water in an oven for ten minutes; after taking it out, use a spin coater to coat a positive photoresist, perform direct writing exposure after baking before exposure, and Then use dilute KOH solution to develop and treat for 40s; then clean it with deionized water and put it in an oven to harden the film for about 10 minutes. Finally dry etching (such as using ICP etching system, CHF ...

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Abstract

The invention discloses a substrate-type diffractive optical element VCSEL light-splitting structure and a preparation method, which sequentially include: a heat sink, a bottom-emitting VCSEL array chip, a substrate layer with a binary diffraction grating, a metasurface structure layer, Protective layer and anti-reflection film layer; the bottom of the substrate layer is provided with the bottom emission VCSEL array chip, the top of the substrate layer is provided with a binary diffraction grating, and the composition microelements of the metasurface structure layer are in a square network lattice structure arrangement. The present invention bonds a diffractive optical element on a bottom-emitting VCSEL chip, splits the laser beam emitted by each light-emitting unit of the VCSEL chip, and increases the order of magnitude of the output laser beam; and bonds a metasurface structure layer on the diffractive optical element, using Focus after laser beam splitting. The VCSEL light-splitting structure of the substrate-type diffractive optical element designed in the present invention can be manufactured in the next step of the semiconductor process, and does not require external optical elements, and can easily realize device miniaturization and chip reduction.

Description

technical field [0001] The invention relates to the technical field of laser beam splitting, in particular to a substrate-type diffractive optical element VCSEL light splitting structure and a preparation method. Background technique [0002] Structured light technology has broad development prospects and wide application fields in modern life and production. Compared with ToF, structured light technology has relatively less calculation, low power consumption, and higher accuracy in the short-range recognition range, so it has great advantages in face recognition and gesture recognition. [0003] The key to structured light technology lies in the integral beam splitting of laser beams by diffractive optical elements (Diffractive Optical Elements, DOE). Relevant optical equipment using structured light technology, through infrared lasers, project light with certain structural characteristics onto the object to be photographed, and then use a special infrared camera to collec...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/183G02B27/09G02B1/14G02B1/11
CPCH01S5/183H01S5/18305G02B27/0944G02B1/11G02B1/14
Inventor 王智勇李尉代京京叶征宇兰天李冲
Owner BEIJING UNIV OF TECH