Method for forming copper layer on circuit board and circuit board with sputtered copper layer

A technology for electroplating copper layers and circuit boards, which is used in printed circuits, printed circuit manufacturing, electrical components, etc., and can solve the problems of high cost of electroless copper plating, complex composition of plating solution, and high process difficulty.
CN112118682AInactive Publication Date: 2020-12-22PEI YING SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
PEI YING SEMICON CO LTD
Publication Date
2020-12-22
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention provides a method for forming a copper layer on a circuit board, and the method comprises the steps: providing a circuit board structure which is provided with a to-be-plated surface, wherein the to-be-plated surface is provided with a conductive region and a non-conductive region; and carrying out sputtering treatment on the to-be-plated surface, and forming a sputtering copper layer in the conductive region and the non-conductive region of the to-be-plated surface. According to the invention, a chemical plating process in a circuit board process in the prior art can be replaced.
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Description

technical field

[0001] The invention relates to a circuit board technology, in particular to a manufacturing process and structure of a copper layer of a circuit board. Background technique

[0002] In the current manufacturing process of circuit boards, it is generally necessary to form a copper layer on the substrate by means of electroless plating or electroplating, and the formed copper layer can be further made into a patterned circuit later. Compared with electroplating, electroless plating has the advantage that after proper surface treatment, a thin layer of copper can be plated on the non-conductor surface. This feature greatly improves the freedom of circuit settings, and is widely used in During the circuit board process.

[0003] However, electroless copper plating also has its disadvantages in that the composition of the plating solution is relatively complex and the process is difficult, which leads to high cost of electroless copper plating. Contents of the...

Claims

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