Computer heat dissipation structure

Abstract

The invention relates to the technical field of computers, in particular to a computer heat dissipation structure which comprises a case body, a detachable side plate is installed on one side of the case body, a detachable key panel is installed on the outer side wall of the case body, and an installation groove corresponding to the key panel is formed in the case body. The inner top of the case body is connected with a computer power supply through fixing screws. According to the computer heat dissipation structure, the structure is simple, the number of heat dissipation parts is small, the cost is low, the assembly process is simple, the fault probability is low, maintenance is convenient, meanwhile, the internal space of the case body cannot be occupied to a large extent, and the minimization process of the case cannot be affected; in addition, dust outside the case body can be effectively prevented from entering the case body, dust in the air is prevented from being attached to components inside the case body, and heat dissipation of the components inside the case body is prevented from being affected.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a computer cooling structure. Background technique [0002] Desktop computer is commonly called as desktop at present, and desktop chassis is generally the cuboid of side opening. All physical components in the chassis are generally called computer hardware, including hard disks, CPUs, memory sticks, graphics cards, light sources, fans, etc. The motherboard is the installation carrier of the above-mentioned electronic components, and other components are also connected to the motherboard through wires. The CPU and the graphics card are the two heat-generating devices with the largest heat generation in the desktop, so a special fan will be installed in the desktop to cool the CPU and the graphics card. [0003] In the existing air-cooled desktop computers, in order to enhance the heat dissipation inside the chassis, multiple cooling fans are arranged on both sides of the chas...

AI Technical Summary

Problems solved by technology

[0010] 1. During the operation of the components, the amount of heat dissipated is limited. To dissipate heat from the components running inside the computer case through many components will be a waste, and increase the cost of the computer case and increase the cost of the computer. The process difficulty of chassis assembly;

[0011] 2. To dissipate heat from the components running inside the computer case through many components will occupy the space inside the computer case to a certain extent, resulting in the inability to miniaturize the computer case

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