Computer heat dissipation structure

A heat dissipation structure and computer technology, applied in the computer field, can solve the problems of increasing the difficulty of the computer case, occupying the space of the computer case, increasing the cost of the computer case, etc., and achieving the effects of low probability of failure, less quantity and low cost.

Pending Publication Date: 2020-12-25
GUILIN UNIV OF ELECTRONIC TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] 1. During the operation of the components, the amount of heat dissipated is limited. To dissipate heat from the components running inside the computer case through many components will be a waste, and increase the cost of the computer case and increase the cost of the compu

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  • Computer heat dissipation structure
  • Computer heat dissipation structure

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Embodiment Construction

[0034]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0035] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0036] refer to Figure 1...

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Abstract

The invention relates to the technical field of computers, in particular to a computer heat dissipation structure which comprises a case body, a detachable side plate is installed on one side of the case body, a detachable key panel is installed on the outer side wall of the case body, and an installation groove corresponding to the key panel is formed in the case body. The inner top of the case body is connected with a computer power supply through fixing screws. According to the computer heat dissipation structure, the structure is simple, the number of heat dissipation parts is small, the cost is low, the assembly process is simple, the fault probability is low, maintenance is convenient, meanwhile, the internal space of the case body cannot be occupied to a large extent, and the minimization process of the case cannot be affected; in addition, dust outside the case body can be effectively prevented from entering the case body, dust in the air is prevented from being attached to components inside the case body, and heat dissipation of the components inside the case body is prevented from being affected.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a computer cooling structure. Background technique [0002] Desktop computer is commonly called as desktop at present, and desktop chassis is generally the cuboid of side opening. All physical components in the chassis are generally called computer hardware, including hard disks, CPUs, memory sticks, graphics cards, light sources, fans, etc. The motherboard is the installation carrier of the above-mentioned electronic components, and other components are also connected to the motherboard through wires. The CPU and the graphics card are the two heat-generating devices with the largest heat generation in the desktop, so a special fan will be installed in the desktop to cool the CPU and the graphics card. [0003] In the existing air-cooled desktop computers, in order to enhance the heat dissipation inside the chassis, multiple cooling fans are arranged on both sides of the chas...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/181G06F1/183G06F1/187G06F1/189G06F1/206
Inventor 李兆伦
Owner GUILIN UNIV OF ELECTRONIC TECH
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