Display panel and display device

Abstract

The invention discloses a display panel and a display device. The display panel comprises an array substrate; the array substrate comprises a binding area; the binding area comprises at least a firstsub-bonding pad, a second sub-bonding pad and a third sub-bonding pad; the distance between the first sub-bonding pad and the second sub-bonding pad is smaller than the distance between the second sub-bonding pad and the third sub-bonding pad; a driving chip comprises a base; the base comprises a fourth sub-bonding pad, a fifth sub-bonding pad and a sixth sub-bonding pad which are insulated from one another; the fourth sub-bonding pad and the first sub-bonding pad are correspondingly arranged and are electrically connected through a conductive adhesive film; the fifth sub-bonding pad and the second sub-bonding pad are correspondingly arranged and are electrically connected through a conductive adhesive film; the sixth sub-bonding pad and the third sub-bonding pad are correspondingly arranged and are electrically connected through a conductive adhesive film; the base comprises a first face; the first face is the face, away from the array substrate, of the base; the first face comprisesa first groove; and the first groove is located between the fifth sub-bonding pad and the sixth sub-bonding pad in a first direction. According to the invention, the first groove is formed in the driving chip, so that the binding yield is improved.

Description

technical field [0001] The present invention relates to the field of display technology, and more particularly, to a display panel and a display device. Background technique [0002] With the development of electronic technology, the manufacture of display panels is becoming more and more mature. The display panels provided by the prior art include liquid crystal display panels, organic light-emitting display panels, plasma display panels, and the like. [0003] Liquid crystal display panel (LCD, Liquid Crystal Display), as a kind of display panel with relatively mature manufacturing process at present, occupies a large market in the field of display panel because of its relatively low cost, good manufacturing yield and good display effect. Liquid crystal display devices have many advantages such as thin body, power saving, and no radiation, and have been widely used, such as LCD TVs, mobile phones, personal digital assistants, digital cameras, computer screens or notebook c...

AI Technical Summary

Problems solved by technology

[0004] Bonding is to realize the electrical connection between the array substrate and the driver chip through the anisotropic conductive adhesive (ACF). The structure and material composition of the anisotropic conductive adhesive directly affect the yield rate after bonding. In the process of crimping the driver chip and the pad on the array substrate, the driver chip is subject to horizontal tensile internal stress and deformation under high temperature and high pressure conditions, which will cause cracks on the driver chip and cause abnormalities. The distribution of conductive particles inside the square conductive adhesive is not uniform or the crimping stress is not uniform. It is very likely that the conductive particles will be locally aggregated or cannot be crushed, which will reduce the bonding yield.

[0005] Therefore, there is an urgent need to provide a display panel and a display device to solve the problems of cracks in the driver chip, uneven distribution of conductive particles, or uneven crimping stress, and improve the bonding yield

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