High-precision plate-free three-dimensional hot stamping process
Patent Information
- Authority / Receiving Office
- CN Β· China
- Current Assignee / Owner
- WENZHOU LIKEDA PRINTING
- Publication Date
- 2021-01-01
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of hot stamping for printed and packaged products, in particular to a high-definition plateless three-dimensional hot stamping process. Background technique
[0002] The traditional hot stamping process mainly uses engraving or etching to make the hot plate according to the hot stamping pattern, and then installs the hot plate on the traditional hot stamping equipment, and transfers the hot stamping paper to the Hot stamping is done on the substrate.
[0003] Because traditional hot stamping requires engraving technology to engrave the hot plate before hot stamping can be carried out. Due to the accuracy bottleneck of engraving technology, some high-definition patterns cannot be realized by traditional hot stamping. In addition, traditional hot stamping is transferred to the substrate by hot stamping paper. The hot stamping UV glue pattern has no three-dimensional effect, and the visual effect and touch effect are no...