Transportable cascaded hundred-level cleaning device and method for semiconductor device packaging
A device packaging and cascading technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of expensive construction, large floor space, and inability to move in Class 100 clean rooms. Small area, easy to disassemble, ensure zero-contact effect
Pending Publication Date: 2021-01-05
武汉光谷航天三江激光产业技术研究院有限公司
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Problems solved by technology
[0004]
At present, the construction cost of the existing class 100 clean room is expensive, and it cannot be moved after one-time construction and assembly, and it occupies a large area
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[0045] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.
[0046] In one embodiment of the present invention, as Figure 1-5 As shown, a transportable cascaded class 100 cleaning device for semiconductor device packaging, including: a sample dewatering operation cabinet 3, a vacuum turnover box 4, and a bonding process cabinet 5 are sequentially connected to each other; the sample dewatering operation cabinet 3 The side wall is provided with a first in...
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The invention discloses a transportable cascade type hundred-grade cleaning device and method for semiconductor device packaging. The transportable cascade type hundred-grade cleaning device for semiconductor device packaging comprises a sample dewatering operation cabinet, a vacuum turnover box and a bonding process cabinet which are sequentially arranged in a communicating mode; a first inlet, afirst outlet, a clean gas inlet and a one-way exhaust structure are arranged on a side wall of a sample dewatering operation cabinet; the first inlet is provided with a first inlet valve; the first outlet is communicated with the vacuum turnover box; a second inlet, a second outlet and a vacuum extraction opening are formed in the side wall of the vacuum turnover box; the second inlet is providedwith a second inlet valve; the second outlet is provided with a first outlet valve; and a third inlet, an oxygen-free clean gas inlet, a pressure gauge and a pressure release valve are arranged on the side wall of the bonding process cabinet. The device is advantaged in that free movement of the hundred-grade cleaning device is achieved, the occupied area is small, a closed and hundred-grade clean machining environment can be formed, and the excellent and good rate of products is greatly increased.
Description
technical field [0001] The invention belongs to the technical field of cleaning devices for semiconductor device packaging, and more particularly relates to a transportable cascaded class 100 cleaning device and method for semiconductor device packaging. Background technique [0002] The clean room and environment of various purification levels can be called an isolation device in essence, which keeps the processing process and the processed products away from and isolates pollution, and improves the excellent rate of finished products. The essence of clean technology is isolation technology. In the development of clean technology, four clean room models in the semiconductor industry have been used in turn. They are: full room type, hybrid type, clean tunnel type and clean management type. [0003] It can be seen from the development direction of the four clean rooms that the development direction of clean technology is to reduce the volume of the ultra-clean area as much as...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L21/67H01L21/02H01L21/50
CPCH01L21/67173H01L21/67207H01L21/67051H01L21/67034H01L21/67011H01L21/02H01L21/02057H01L21/02082H01L21/50
Inventor 赵坤王晓飞胡金萌庹文波李子熙张璐姜永亮李强
Owner 武汉光谷航天三江激光产业技术研究院有限公司