Glue removing method for mixed-pressing PCB

Abstract

The invention provides a glue removing method for a mixed-pressing PCB, and the method comprises the following steps: S1, carrying out the mixed-pressing of different types of materials which comprisea first material and a second material which are different in glue removing difficulty, and the glue removing difficulty of the first material is greater than the glue removing difficulty of the second material; s2, drilling a through hole in the laminated PCB; s3, after drilling, performing depth-controlled hole plugging on the through hole by adopting resin, and performing hole plugging on thehole section corresponding to the second material without hole plugging on the hole section corresponding to the first material; s4, after depth plug control, carrying out first degumming on the holesection corresponding to the first material; s5, after the first degumming is completed, dissolving and cleaning the resin in the hole section corresponding to the second material; and S6, performingsecondary degumming on the through holes, and removing glue residues on the hole sections, corresponding to the first material and the second material, of the through holes fully at the same time. According to the glue removing method of the mixed-pressing PCB, degumming can be conducted on different types of materials at the same time, and the degumming effect is improved.

Description

technical field [0001] The invention relates to the technical field of PCB fabrication, in particular to a method for removing glue from a mixed-pressure PCB. Background technique [0002] With the rapid development of 5G communication technology, the demand for materials from end customers is increasing, and the functional requirements for materials are also becoming more and more abundant. At present, the structure of mixing high-speed materials and FR4 materials, high-speed materials and high-frequency materials, and high-speed materials and functional materials is widely used in PCB manufacturing. Due to the significant differences in the difficulty of removing glue for different types of materials, the control of the amount of glue removed from the hole wall after drilling the PCB with the mixed-pressed structure has always been a difficult point for technological research to break through. Specifically, when two materials with significantly different levels of glue re...

AI Technical Summary

Problems solved by technology

Specifically, when two materials with significantly different levels of glue removal are mixed and pressed into a PCB, glue slag is formed on the hole wall after drilling. Specifically, the PCB will generate instantaneous high temperature when drilling, and the substrate (commonly FR-4) or the resin material used to connect the copper layers is a poor conductor, and the heat will be highly accumulated during drilling, and the surface temperature of the hole wall will melt when the temperature of the hole wall exceeds the glass transition temperature of the resin. Flow, thus forming a thin layer of slag, the slag is not the burrs and burrs drilled by mechanical drilling, the slag is mainly hydrocarbons, if the slag is not removed, it will make the inside of the multi-layer board The layer signal line is not connected, or the connection is unreliable, so glue removal is required. At present, the industry generally uses the same glue removal method to remove glue, but in the process of glue removal, the glue removal parameters (same glue remover, same glue removal Concentration, degumming time and other parameters) cannot match the desmearing effect of the two materials well at the same time. When the degumming parameters of the easy-to-remove material are selected, it is easy to cause the pore wall of the difficult-to-remove material to be inexhaustible. Using the degumming parameters of difficult-to-remove materials may easily cause excessive degumming of easy-to-remove materials. Even through conventional degumming parameter optimization, the goal of simultaneous and sufficient degumming cannot be achieved.

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