Leak detection device and leak detection method

Abstract

The invention provides a leak detection device and a leak detection method. The leak detection device comprises an inflation area, a to-be-detected station area and a test area. The inflation area isused for inflating and deflating the to-be-detected station area. The to-be-detected station area comprises a test container and a first vacuum pump for vacuumizing the test container. The test area comprises a mass spectrum chamber, a molecular pump set, a getter pump, a quadrupole mass spectrometer, liquid nitrogen cold hydrazine, a second vacuum pump, a dynamic leak detection standard leak holeand an accumulated leak detection standard leak hole. The test container is communicated with the mass spectrum chamber through a valve assembly, the quadrupole mass spectrometer is connected with the mass spectrum chamber, the liquid nitrogen cold hydrazine is connected with the mass spectrum chamber, and the molecular pump set, the getter pump, the dynamic leak detection standard leak hole andthe accumulated leak detection standard leak hole are respectively communicated with the mass spectrum chamber through valve assemblies. The beneficial effects are that the vacuum dynamic leakage detection of a to-be-detected component can be realized through the single use of the molecular pump set; and vacuum accumulated leak detection of the to-be-detected component can be realized through cooperation of a getter pump, a molecular pump and the liquid nitrogen cold hydrazine.

Description

technical field

[0001] The invention relates to the technical field of sealing performance testing of microelectronic components, in particular to a leak detection device and a leak detection method. Background technique

[0002] With the increasing complexity of weapon systems, military microelectronic components have become an important factor affecting the quality of bombs, arrows, stars and many other weapons and equipment. Most qualified microelectronic components still require hermetic packaging, and measuring the leak rate of hermetically packaged components has become a key link in screening. If the sealing performance of microelectronic components exceeds the standard, the water vapor content inside the sealed device will exceed the standard after long-term storage, causing the components to fail. For example, when the temperature of components drops below the internal water vapor dew point, condensation and frost will cause poor contact of contacts, a sharp increa...

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