Anti-falling fixing device based on semiconductor chip

Abstract

The invention discloses an anti-falling fixing device based on a semiconductor chip. The anti-falling fixing device comprises a mounting plate, a fixing mechanism, a mounting frame and a heat dissipation mechanism, wherein a mounting groove is formed in the mounting plate; a dust collection mechanism comprises an air pump, an air pipe and a suction cup; the air pump is fixed inside the right sideof the mounting plate; the fixing mechanism comprises a fixing frame, a pressing plate and a sponge pad; and the fixing frame is mounted on the mounting groove. The anti-falling fixing device based onthe semiconductor chip is provided with the fixing frame, a fixing block, a sliding groove, a vertical rod, a sliding block, a fourth spring and the pressing plate, a handle on the vertical rod is rotated to drive the sliding block on the vertical rod to slide in the sliding groove in the fixing block so as to drive the vertical rod to ascend to increase the height, the chip can be conveniently placed inside the mounting frame below, the vertical rod is driven to descend under the elastic force action of the fourth spring at the bottom of the fixing block when the handle is loosened, and meanwhile, the pressing plate below the vertical rod is driven to press the mounting frame to fix the chip inside the mounting frame, falling off of the chip in the transportation process is prevented, and the practicability is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor chips, in particular to an anti-drop fixing device based on semiconductor chips. Background technique [0002] Semiconductor chips are widely used in the electronics industry due to their small size and versatility. Semiconductor devices can be used as storage devices for storing data and hybrid devices that operate various functions at the same time. However, during the transportation of chips, friction between chips is easy to cause The chip is worn out, and the surface of the chip is easy to absorb dust during transportation. If it is not cleaned for a long time, the dust will stick to the surface of the chip. It will be troublesome to clean up later, and because the chip is thin, it is easy to shake during transportation. As a result, the chip breaks, and when the chip is taken out after transportation, static electricity will be generated due to the different physique of each person, an...

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Problems solved by technology

[0003] The purpose of the present invention is to provide an anti-drop fixing device based on semiconductor chips to solve the friction between the chips proposed in the above background technology to cause wear, and the surface of the chip is easy to absorb dust, and the vibration during transportation is easy to cause the chip to break, take it out The static electricity generated at the time will cause the chip to be scrapped and increase the cost

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