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Shell, manufacturing method thereof and electronic equipment

A manufacturing method and shell technology, applied in the direction of electrical equipment casings/cabinets/drawers, electrolytic coatings, electrical components, etc., can solve the problems of unfavorable thinning and large thickness of electronic products, and achieve the advantages of thinning and small thickness Effect

Inactive Publication Date: 2021-01-15
REALME MOBILE TELECOMM SHENZHEN CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the above method removes the oxide layer, the aluminum alloy substrate is also lost, so a thicker aluminum alloy substrate is reserved, which leads to a larger thickness of the electronic product, which is not conducive to the thinning of the electronic product

Method used

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  • Shell, manufacturing method thereof and electronic equipment
  • Shell, manufacturing method thereof and electronic equipment
  • Shell, manufacturing method thereof and electronic equipment

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Experimental program
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Embodiment Construction

[0020]The following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the protection scope of this application.

[0021]In one aspect of the embodiments of the present application, a manufacturing method of a housing is proposed.

[0022]According to the embodiments of this application, referencefigure 1 as well asFigure 7-9 , The manufacturing method of the housing 100 includes the following steps:

[0023]S10: Provide base 10. Wherein, the surface of the base 10 includes a first area 101 and a second area 102.

[0024]Specifically, the base 10 is a semi-finished product th...

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PUM

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Abstract

The invention relates to a shell, a manufacturing method thereof and electronic equipment. The method comprises the following steps: 1, a substrate is arranged, and the surface of the substrate comprises a first region and a second region; 2, a shielding layer is formed on the first region, wherein the shielding layer is resistant to anodic oxidation corrosion; 3, first anodic oxidation treatmentis performed on the substrate to form a first anodic oxidation layer on the second region; 4, the shielding layer is stripped; and 5, secondary anodic oxidation treatment is performed on the substrateto form a second anodic oxidation layer on the first region and / or form a third anodic oxidation layer at one side, far away from the substrate, of the first anodic oxidation layer, first color of the first anodic oxidation layer, second color of the second anodic oxidation layer and third color of the third anodic oxidation layer are different from each other. By the mode, the double-color or three-color appearance effect of the shell is achieved, the thickness of a base material is smaller, and lightening and thinning of electronic products are facilitated.

Description

Technical field[0001]This application relates to the technical field of metal surface treatment, in particular to a housing, a manufacturing method thereof, and electronic equipment.Background technique[0002]With the rapid development of electronics and communication equipment, people have higher and higher requirements for the quality of electronic products. The trend of all-metallization of electronic product body materials is obvious. Among them, aluminum alloy casing with anodizing treatment is one of the mainstream methods today. .[0003]At this stage, the methods to achieve two color appearance effects on aluminum alloy casings are: first oxidize and dye the aluminum alloy substrate A, then remove the oxide layer in the local area, and then oxidize and dye B. In the above method, the aluminum alloy substrate is also lost when the oxide layer is removed. Therefore, a thicker aluminum alloy substrate is reserved, which in turn leads to a larger thickness of the entire electronic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D11/12C25D11/18C25D11/16C23F3/03H05K5/02
CPCC23F3/03C25D11/022C25D11/12C25D11/16C25D11/18H05K5/0243
Inventor 陈凯
Owner REALME MOBILE TELECOMM SHENZHEN CO LTD