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Press-fit connection structure between circuit boards and press-fit connection method thereof

A connection structure and connection method technology, applied in the structural connection of printed circuits, electrical connection of printed components, printed circuits, etc., can solve the problems of delamination, position deviation, uneven pressure, etc. Stable pressure distribution and uniform filling

Inactive Publication Date: 2021-01-15
刘长华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem in the prior art that "the lamination structure requires stacking and typesetting the multi-layer boards one by one before lamination. The lamination process is prone to position deviation, and may cause uneven pressure and delamination. Phenomenon" defects, thus proposing a press-fit connection structure and press-fit connection method between circuit boards

Method used

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  • Press-fit connection structure between circuit boards and press-fit connection method thereof
  • Press-fit connection structure between circuit boards and press-fit connection method thereof
  • Press-fit connection structure between circuit boards and press-fit connection method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] refer to Figure 1-3 , a press-fit connection structure between circuit boards, including an outer sealing part 1, an inner core part 2 and a base part 3, the outer sealing part 1 and the inner core part 2, the inner core part 2 and the base part 3 are all glued by UV curing The laminated layer 4 is pressed and connected. The outer sealing part 1 includes a transparent protective layer 101 and a silicon-aluminum foil layer 102. The thickness of the transparent protective layer 101 is 1 mm. The transparent protective layer 101 is a double-layer or single-layer structure. The thickness of the silicon-aluminum foil layer 102 is 2mm, the silicon aluminum foil layer 102 is connected to the bottom side of the transparent protective layer 101, the inner core 2 includes a water-soluble organic film layer 201, a flexible circuit board 202 and a flexible layer 203, and the flexible circuit board 202 is connected to the bottom of the water-soluble organic film layer 201 On the sid...

Embodiment 2

[0038] A press-fit connection structure between circuit boards, including an outer sealing part 1, an inner core part 2 and a base part 3, and the outer sealing part 1 and the inner core part 2, and the inner core part 2 and the base part 3 are all bonded by UV curing Layer 4 is pressed and connected, and the outer sealing part 1 includes a transparent protective layer 101 and a silicon-aluminum foil layer 102. The thickness of the transparent protective layer 101 is 3 mm. The transparent protective layer 101 is a double-layer or single-layer structure, and the thickness of the silicon-aluminum foil layer 102 is 5 mm. , the silicon aluminum foil layer 102 is connected to the bottom side of the transparent protective layer 101, the inner core part 2 includes a water-soluble organic film layer 201, a flexible circuit board 202 and a flexible layer 203, and the flexible circuit board 202 is connected to the bottom side of the water-soluble organic film layer 201 , the thickness of...

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Abstract

The invention discloses a press-fit connection structure between circuit boards. The connection structure comprises an outer sealing part, an inner core part and a base layer part, the outer sealing part and the inner core part as well as the inner core part and the base layer part are in press-fit connection through UV curing bonding layers, the outer sealing part comprises a transparent protective layer and a silicon aluminum foil layer, and the silicon aluminum foil layer is connected to the bottom side surface of the transparent protective layer; the inner core part comprises a water-soluble organic thin film layer, a flexible circuit board and a flexible layer, the flexible circuit board is connected to the bottom side surface of the water-soluble organic thin film layer, the flexiblelayer is connected to the bottom side surface of the flexible circuit board, and the base layer part comprises a green silica gel layer and a steel plate. The connection structure is advantaged in that the silicon-aluminum foil layer and the steel plate are uniformly heated, the laminating temperature rise speed is stable, the pressure distribution is stable, and glue filling is uniform and flat,so that the glue overflowing phenomenon is prevented, the laminated product yield is high, quick laminating facilitates quality monitoring in the production process, production parameters are adjusted in time, and the quality yield is effectively improved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a press-fit connection structure and a press-fit connection method between circuit boards. Background technique [0002] The names of the circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed (copper etching technology) circuit boards, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. The circuit board can be called a printed circuit board or a printed circuit board, and the FPC circuit board (FPC circuit board is also called a flexible circuit board). , an excellent flexible printed circuit boar...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K1/14H05K3/36
CPCH05K1/111H05K1/144H05K3/368
Inventor 刘长华
Owner 刘长华