Jig temporary storing mechanism and method for light attenuation resistance treatment of solar silicon wafer

Abstract

The invention relates to the technical field of solar silicon wafer production, and particularly relates to a jig temporary storing mechanism and method for light attenuation resistance treatment of asolar silicon wafer. The mechanism comprises a jig moving assembly, a jig storage assembly and a jig output assembly, wherein the output end of the jig output assembly is connected with a feeding port of a light attenuation furnace; the jig moving assembly is used for receiving and moving the solar silicon wafer; the jig storage assembly is used for storing redundant solar silicon wafers; and thejig output assembly is used for outputting the solar silicon wafer to the light attenuation furnace. According to the mechanism and method, the jig storage assembly is arranged, so that the temporarystoring step of positioning a jig is reduced, and the quality of the solar silicon wafer in the temporary storing process is improved.

Description

technical field [0001] The invention relates to the technical field of solar silicon wafer production, in particular to a jig buffer mechanism and method for anti-light decay treatment of solar silicon wafers. Background technique [0002] At present, boron-doped P-type crystalline silicon solar cells occupy more than 70% of the photovoltaic market. However, the efficiency of this type of solar cell will decrease when it is used. This phenomenon is called light-induced attenuation. Light attenuation research is to place the silicon wafer under the light source for irradiation, test its electrical properties before and after irradiation and obtain the corresponding light attenuation range. To study the light attenuation of silicon wafers, it is generally to place the silicon wafers in a light attenuation chamber that simulates a solar generator for illumination, and then test the electrical properties of the silicon wafers. When studying the light attenuation of silicon wafe...

AI Technical Summary

Problems solved by technology

[0004] The prior art has the following deficiencies: when caching redundant positioning fixtures, the redundant positioning fixtures are first moved to the buffering station with a moving device, and then the positioning fixtures on the buffering station are moved with the moving device when needed To the jig output station; and this kind of buffering method requires a moving device to carry when positioning the jig input and output, and the moving device needs to complete the three steps of moving down, grabbing, translational transportation, and jig falling to complete the caching of the positioning jig , thereby increasing the complexity of the equipment and the caching steps of the positioning fixture; at the same time, the solar silicon wafer is a hard and brittle material, and the impact force generated during the process of handling, grabbing, moving up and falling may easily cause the solar silicon stacked in the positioning fixture to Wafers squeeze and collide with each other; resulting in cracking of solar silicon wafers, reducing the quality of solar silicon wafers in the caching process

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