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Micro-welding-spot creep life testing device and using method

A creep life and testing device technology, applied in measuring devices, using stable tension/pressure to test material strength, instruments, etc., can solve the problems of high testing cost, complex equipment structure, low accuracy, etc., to reduce testing The effect of cost, high precision and precise measurement

Pending Publication Date: 2021-01-22
GUILIN UNIV OF ELECTRONIC TECH
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] The purpose of the present invention is to provide a micro-solder joint creep life testing device and its use method, aiming to solve the problem that the accuracy of the traditional test method is not high and the complex structure of the existing equipment makes the test cost higher

Method used

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  • Micro-welding-spot creep life testing device and using method
  • Micro-welding-spot creep life testing device and using method
  • Micro-welding-spot creep life testing device and using method

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Embodiment Construction

[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0024] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element...

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Abstract

The invention discloses a micro-welding-spot creep life testing device and a using method thereof.The micro-welding-spot creep life testing device comprises a supporting assembly, a clamping assemblyand a measuring assembly, wherein a base, a lower supporting frame and an upper supporting frame of the supporting assembly are connected in sequence, a first clamp holder and a second clamp holder ofthe clamping assembly are slidably connected with the upper supporting frame and the lower supporting frame respectively, a hanging ring of the measuring assembly is installed on the second clamp holder, a liquid weight is connected with the hanging ring through a hanging rope, the testing system is installed on one side of the base. A test sample is fixed by means of the first clamp holder and the second clamp holder, then the liquid weight with preset weight is hung, and after the test sample is broken, the liquid weight triggers an infrared sensor in a test system to obtain the creep lifeof the test sample. The micro-welding-spot creep life testing device is simple in structure, can be used for testing a micro welding spot sample with the diameter of 0.51 mm, and is higher in precision compared with a traditional uniaxial tension testing method, so that the testing cost can be reduced.

Description

technical field [0001] The invention relates to the field of performance testing of metal materials, in particular to a micro-welding spot creep life testing device and a use method. Background technique [0002] Micro-solder joints in electronic packaging devices are responsible for mechanical support, electrical connection and heat conduction. The reliability of micro-solder joints is the core issue of reliability of electronic packaging products, which determines the service life of components. Due to the mismatch between the thermal expansion coefficients of the components and the circuit board, micro-solder joints are exposed to long-term thermal stress service environments, which are prone to creep deformation and damage. Creep refers to the plastic deformation of materials under constant temperature and stress for a long time. The typical creep process of materials can be roughly divided into three stages: initial creep stage, steady state creep stage and accelerated ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/12G01N3/04
CPCG01N3/04G01N3/12G01N2203/0048G01N2203/0071
Inventor 秦红波秦薇岳武李望云黄家强蔡苗杨道国张国旗
Owner GUILIN UNIV OF ELECTRONIC TECH
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