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Withstand voltage test device for semiconductor production

A withstand voltage test and semiconductor technology, which is applied in the field of withstand voltage test devices for semiconductor production, can solve the problems of easy electric shock, threat to the safety of operators, and the influence of semiconductor withstand voltage test, so as to avoid pressure damage and ensure the accuracy of withstand voltage test Effect

Inactive Publication Date: 2021-01-22
新乡飞特电子信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] A semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature. Semiconductors are widely used in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. Control, ranging from materials between insulators and conductors. With the continuous development of society, more and more semiconductors are produced, and there are more and more related equipment for semiconductor production. However, some semiconductor production uses withstand voltage test devices When in use, its conductive contacts are prone to dirt after long-term use, especially when dust and foreign matter are attached to the outside of the semiconductor, which will affect the accuracy of the semiconductor withstand voltage test, and it is easy to crush the semiconductor, and there is It will be affected by the humidity of the external air, and it will also affect the withstand voltage test of the semiconductor. Finally, it is inconvenient to connect and disassemble the connecting wire, and it is prone to electric shock, which threatens the safety of operators.

Method used

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  • Withstand voltage test device for semiconductor production
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  • Withstand voltage test device for semiconductor production

Examples

Experimental program
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Effect test

Embodiment 1

[0025] see figure 1 , figure 2 , image 3 , Figure 4 with Figure 5 , the present invention provides a technical solution:

[0026]A withstand voltage test device for semiconductor production, comprising a fixed frame 1, a protective device 2 and a connecting device 6, the outer side of the fixed frame 1 is provided with a protective device 2, the protective device 2 includes a protective box 201, and the outer side of the fixed frame 1 is fixedly connected with a protective box 201, a humidity sensor 202 is fixedly connected to the upper left inside of the protective box 201, a drying box 203 is fixedly connected to the top of the protective box 201, and the drying box 203 runs through the protective box 201, and an air pump 204 is connected to the inner side of the bottom end of the drying box 203, and the inside of the drying box 203 The top is slidingly connected with a drying filter 205, and the inner side of the box cover 206 is fixedly connected with a rubber bloc...

Embodiment 2

[0029] The same parts as those in Embodiment 1 will not be repeated in Example 2, but the difference is that the left end of the fixed frame 1 is connected with a bellows 14, and the bellows 14 runs through the protective device 2, and the bellows 14 is fixedly connected with the protective device 2, and the inside of the bellows 14 The adsorption filter screen 15 and fan 16 are fixedly connected to the left and right. The right end of the bellows 14 is connected with the air pipe 17, and the other end of the air pipe 17 is connected with the nozzle 18. The inclination angle of the nozzle 18 is 30°. Before the semiconductor is tested, the contact block and the semiconductor can be cleaned, thereby avoiding the phenomenon that a large amount of dirt attached to the outside of the contact block caused by long-term use will affect the test. By cleaning the dust and foreign objects outside the semiconductor, it is also avoided. The phenomenon of crushing ensures the accuracy of the...

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Abstract

The invention relates to the technical field of semiconductor production, and especially relates to a withstand voltage test device for semiconductor production. The test device comprises a fixing frame, a protective device and a connecting device, the protective device is arranged on the outer side of the fixing frame, the top end of the right side of the protective device is fixedly connected with an indicator lamp and a controller which are arranged up and down, the connecting device is arranged on the right side of the fixing frame, and a first electric telescopic rod is fixedly connectedto the inside top end of the fixing frame. According to the invention, through the arrangement of a sponge brush and a first spring, the sponge brush is driven by a motor, a second electric telescopicrod is rotatably connected with a positioning plate, the first spring applies an elastic force to a sliding plate, and before the device is used for testing a semiconductor with a clean surface, a contact block can be cleaned, so that the phenomenon that a large amount of dirt is attached to the outer side of the contact block due to long-time use to influence the test is avoided, the phenomenonthat a semiconductor is crushed is also avoided, and the withstand voltage test precision of the semiconductor is ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductor production, in particular to a withstand voltage test device for semiconductor production. Background technique [0002] A semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature. Semiconductors are widely used in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. Control, ranging from materials between insulators and conductors. With the continuous development of society, more and more semiconductors are produced, and there are more and more related equipment for semiconductor production. However, some semiconductor production uses withstand voltage test devices When in use, its conductive contacts are prone to dirt after long-term use, especially when dust and foreign matter are attached to the outside of the semiconductor, which will affect the accuracy of the semicondu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G05D22/02
CPCG01R31/2642G05D22/02
Inventor 王哲
Owner 新乡飞特电子信息技术有限公司
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