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Novel rigid-flex board combination mode

A combination of soft and hard boards, which is applied to the formation of electrical connections of printed components, electrical components, and printed circuit manufacturing. It can solve the problems of no filling process and low yield of time-sensitive products, and improve product yield. , saving labor costs, high timeliness effect

Inactive Publication Date: 2021-01-22
江苏鑫迈迪电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a new combination method of soft and rigid boards to solve the timeliness of filling and the low yield of products in the production process of traditional soft and hard boards proposed in the above background technology, and the process does not have the problem of filling process question

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  • Novel rigid-flex board combination mode
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Embodiment Construction

[0011] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative work all belong to the protection scope of the present invention.

[0012] see Figure 1-2 , the utility model provides a technical solution: a new combination of soft and hard boards, including a soft board 1, a first hard board 2, PP glue 3, a second hard board 4 and a cutting line 5, the soft board 1 The first hard board 2 is arranged on the top, and the second hard board 4 is arranged on the first hard board 2. The first hard board 2 and the second hard board 4 are fixed by PP glue 3, and the hard board is decomposed...

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Abstract

The invention discloses a novel rigid-flex board combination mode, which involves a flexible board, a first rigid board is arranged on the flexible board, a second rigid board is arranged on the firstrigid board, and the first rigid board and the second rigid board are fixed through a PP glue. According to the novel rigid-flex board combination mode, timeliness is high, labor cost is saved, in the manufacturing process, it is avoided that in a copper deposition and plating technology, liquid medicine permeates into filled gaps to affect the product quality, therefore the product yield is increased.

Description

technical field [0001] The invention relates to the technical field of electronic circuit boards, in particular to a new type of combination of soft and hard boards. Background technique [0002] Electronic circuit boards originated in the United States. The product has a high degree of integration. Its characteristics are: softness, bending resistance, and high functional integration. Because it is too soft, it is not conducive to SMT soldering. Therefore, some products with high requirements will use soft and hard boards. Instead, to achieve SMT welding and soft bending problems, generally used in medical, aerospace and communication fields. [0003] The timeliness of filling and the yield rate of products in the production process of traditional rigid-flex boards are low, and there is no filling process in the process. In view of the above problems, the existing ones need to be improved. Contents of the invention [0004] The purpose of the present invention is to prov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/40
CPCH05K3/4015
Inventor 柯可木高水平高宝平范刚
Owner 江苏鑫迈迪电子有限公司