Manufacturing method of high-heat-dissipation PCB

Abstract

The invention discloses a manufacturing method of a high-heat-dissipation PCB, and relates to the technical field of rigid-flexible printed circuit board manufacturing. According to the manufacturingmethod, FR4 and flexible lamination are used for manufacturing, and copper-based bosses are embedded into a FR4 core plate, so that the heat dissipation capacity of the plate is improved; a bending area is milled in a depth control milling mode to replace an uncovering process, a window does not need to be opened in advance in a place where flexibility needs to be exposed, or windows do not need to be opened in FR4 and PP bending areas, the problem that a dry film cannot be tightly attached to a circuit and is difficult to manufacture due to pressing sinking caused by windowing in the bendingarea is solved through the depth control milling mode, and meanwhile operation is simpler. And the reject ratio of scrapped products due to production operation can be greatly reduced.

Description

technical field [0001] The invention relates to the technical field of rigid-flex board manufacturing, in particular to a method for manufacturing a high heat dissipation PCB. Background technique [0002] With the continuous upgrading of the electronic communication industry and household electronics, the requirements for related circuit board products are getting higher and higher, mainly tending to the development requirements of miniaturization, multi-function, and high reliability. Therefore, the packaging form of electronic products is required to be three-dimensional Three-dimensional assembly development. At this stage, rigid-flex boards are usually used in the industry to realize products with such requirements. Rigid-flex boards can not only provide support for rigid circuit boards, but also realize partial bending, and are widely used in three-dimensional assembly of electronic products. There are several ways to make such products in the industry: [0003] 1. P...

AI Technical Summary

Problems solved by technology

[0003] 1. Pure FR4 rigid laminated board, by controlling the depth and milling the area that needs to be bent, this method requires high precision of equipment depth control, and uneven thickness will easily cause the board to break; 2. FR4 and flexible laminated board, this method presses Before closing, the PP sheet needs to open the window in the area where the flexibility needs to be exposed. This design has a pressing depression, which will lead to incomplete dry film and difficult defects in circuit production. At the same time, there will be glue overflow, which will make it difficult to open the cover; 3. FR4 With flexible laminates, FR4 and PP sheets need to open windows in the bending area before lamination. This method has the risk of breakage and damage in the subsequent production process

The above three methods are the most commonly used methods for producing rigid-flex boards at this stage, and the three methods are not fully mature.

[0004] Although rigid-flex boards have good three-dimensional assembly capabilities, the heat dissipation performance of such products is not ideal. Therefore, there is an urgent need for a high-heat dissipation PCB manufacturing method with good heat dissipation effects, simple manufacturing methods, and high yields.

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