Power supply circuit packaging structure

Abstract

The invention provides a power supply circuit packaging structure which comprises a substrate, a metal enclosure frame, a cover plate, a power supply circuit module, an external bonding pad and a conductive connecting piece, and is characterized in that the substrate and the metal enclosure frame form a cavity with an opening at the upper part, and the power supply circuit module is arranged in the cavity and is sealed by the cover plate. The power supply circuit module is electrically connected with an external bonding pad through a conductive connecting piece in the substrate, the conductiveconnecting piece comprises conductive columns and embedded transmission lines which are electrically connected, the substrate comprises a plurality of layers of substrates which are stacked up and down, the conductive columns are assembled in a plurality of through holes in each layer of substrate, and the upper and lower adjacent conductive columns are electrically connected through the embeddedtransmission lines arranged between the substrates. According to the invention, the problems of storage and use in the aspects of air tightness, mechanical strength, chemical performance stability and the like of a plastic package structure used by a conventional power supply module can be effectively solved.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to a circuit packaging structure. Background technique [0002] The voltage output by the rectifier circuit is pulsating and has poor linearity, so it cannot be directly used by electronic circuits. Generally, the module power supply has a plastic package structure, and its mechanical strength, packaging airtightness, chemical stability and thermal stability are weak, and there are hidden dangers in reliability such as storage and application. SUMMARY OF THE INVENTION [0003] In order to solve the above problems, the present invention provides a power circuit packaging structure, which can effectively avoid storage and use problems such as air tightness, mechanical strength and stable chemical properties of the plastic packaging structure used in conventional power modules. [0004] To achieve the above object, the technical solution of the present invention is: [0005] A po...

AI Technical Summary

Problems solved by technology

[0002] The voltage output by the rectifier circuit is pulsating and has poor linearity, so it cannot be directly used by electronic circuits

Generally, the module power supply is a plastic-encapsulated structure, and its mechanical strength, packaging airtightness, chemical stability and thermal stability are weak, and there are hidden dangers in storage and application reliability.

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