The invention relates to the technical field of
electroplating equipment, in particular to an annular high-purity
copper phosphorus anode for an
integrated circuit and a preparation method of the annular high-purity
copper phosphorus anode. The preparation method comprises the following steps: firstly,
smelting to prepare a
copper-
phosphorus cast
ingot, then carrying out homogenization heat treatment on the cast
ingot, then carrying out reverse
extrusion deformation to obtain a tube blank, then carrying out low-
temperature stress relief annealing treatment on the tube blank, and finally,
cutting,
machining and forming, cleaning,
drying and packaging the tube blank to obtain the annular high-purity copper-phosphorus
anode. According to the preparation method disclosed by the invention, the grain size and the component uniformity are controlled by carrying out homogenization treatment, adjusting the
extrusion temperature and the
extrusion ratio and carrying out low-temperature annealing treatment on a cast
ingot, and meanwhile, a plurality of copper-phosphorus target blanks can be obtained at one time by
cutting a copper-phosphorus
alloy pipe; by means of the preparation method, it can be guaranteed that
crystal grains are evenly distributed, segregation of the P element is avoided,
residual stress of the material is eliminated, deformation and
cracking of follow-up
machining blanks are prevented, meanwhile, the technological process can be remarkably shortened, the production efficiency is improved, and the production cost is reduced.