Circuit board device and electronic equipment

A technology of circuit boards and sub-circuit boards, which is applied in the direction of circuit heating devices, printed circuits, printed circuits, etc., can solve problems such as poor heat dissipation of circuit boards, achieve the effects of improving user experience, improving reliability, and preventing electronic devices from failing

Active Publication Date: 2021-01-29
VIVO MOBILE COMM CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The application discloses a circuit board device and electronic equipment, which can solve

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board device and electronic equipment
  • Circuit board device and electronic equipment
  • Circuit board device and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0023] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0024] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a circuit board device and electronic equipment, the disclosed circuit board device comprises a circuit board, a liquid driving part and a phase change medium, the circuit board is provided with a sealing cavity, the liquid driving part and the phase change medium are both arranged in the sealing cavity, the sealing cavity is provided with an evaporation area and a condensation area, the first end of the liquid driving piece is located in the evaporation area, the second end of the liquid driving piece is located in the condensation area, and the liquid driving part canconvey the phase change medium condensed into the liquid state to the evaporation area. According to the scheme, the problem that a circuit board in the electronic equipment is poor in heat dissipation performance can be solved.

Description

technical field [0001] The present application relates to the technical field of circuit board heat dissipation, in particular to a circuit board device and electronic equipment. Background technique [0002] With the improvement of user requirements, electronic equipment has more and more functions, which leads to more and more electronic devices integrated in the electronic equipment. More and more electronic devices not only bring new challenges to the stacking design of circuit boards, but also cause more heat to be generated during the operation of electronic devices. [0003] Take the addition of game functions to electronic devices as an example. With the improvement of user requirements for game quality, fluency, 3D image perception and online number, electronic devices need more powerful processors, and the structure of processors is more complex ( Contains more electronic components) and runs faster, which will cause the electronic equipment to generate more heat ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H05K1/02
CPCH05K1/0201H05K1/0203H05K2201/064
Inventor 郭阳
Owner VIVO MOBILE COMM CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products