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Apparatus and method for removing particles in semiconductor manufacturing

A technology of semiconductors and particles, applied in semiconductor/solid-state device manufacturing, cleaning methods using gas flow, chemical instruments and methods, etc., can solve problems such as unsatisfactory technology, reduced yield, voids, etc.

Inactive Publication Date: 2021-02-02
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, the yield of a process is drastically degraded by the presence of contaminating particles generated during deposition or etching of layers, which can lead to the formation of voids or short circuits, resulting in performance and reliability impairments in semiconductor manufacturing. defect
While existing technology is adequate for its intended purpose, said technology is not entirely satisfactory in all respects

Method used

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  • Apparatus and method for removing particles in semiconductor manufacturing
  • Apparatus and method for removing particles in semiconductor manufacturing
  • Apparatus and method for removing particles in semiconductor manufacturing

Examples

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Embodiment Construction

[0055] The following disclosure provides a number of different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, the formation of a first feature over or on a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include that additional features may be described in An embodiment is formed between a feature and a second feature such that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat drawing numerals and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations...

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Abstract

A method for removing particles from a semiconductor process chamber including at least the following steps is provided. Electrical charges having a first polarity are accumulated on a receiving surface of the substrate holder by applying a voltage to the substrate holder. The particles having a second polarity in the semiconductor process chamber are attracted to move toward the receiving surfaceof the substrate holder on which the electrical charges having the first polarity are accumulated, where the first polarity is opposite to the second polarity. The particles having the second polarity are removed from the semiconductor process chamber. Other methods for removing particles from a semiconductor process chamber are also provided.

Description

technical field [0001] Embodiments of the present invention relate to a semiconductor device and method, in particular to a device and method for removing particles in semiconductor manufacturing. Background technique [0002] As semiconductor devices are scaled down, the complexity of integrated circuit fabrication increases. The increasing trend of miniaturization of semiconductor devices requires strict control of cleanliness in process chambers in which semiconductor processes are performed, resulting in tighter control of impurities and / or contaminants allowed in the process chambers. For example, the yield of a process is drastically degraded by the presence of contaminating particles generated during deposition or etching of layers, which can lead to the formation of voids or short circuits, resulting in performance and reliability impairments in semiconductor manufacturing. defect. Although the existing technology is adequate for its intended purpose, said technolo...

Claims

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Application Information

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IPC IPC(8): H01L21/67B08B5/02
CPCB08B5/02H01L21/67011H01L21/67028H01L21/6833H01L21/67225G03F7/70925G03F7/70708G03F7/70933H01L21/67167G03F7/70033B08B6/00
Inventor 杨岳霖廖启宏
Owner TAIWAN SEMICON MFG CO LTD
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