Circuit board and manufacturing method thereof

Abstract

The invention provides a circuit board and a manufacturing method therefor, and the circuit board comprises a plurality of core boards which are arranged in a stacked manner, and the surfaces of at least part of the core boards comprises circuit layers; a groove penetrating through part of the core boards is formed in the circuit board; a conductive substance is formed in the groove and used for connecting the circuit layers in the at least two core boards; the size of the cross section of the groove in the first direction is greater than that of the cross section of the groove in the second direction, so that electroplating liquid can be in contact with any part in the groove so as to perform electroplating to form the conductive substance. By changing the shape of the groove, the problemthat the liquid exchange space is insufficient when a hole is electroplated is solved, the electroplating capacity of the hole is improved, and the depth ratio of the hole is increased.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board and a manufacturing method thereof. Background technique [0002] As an important electronic connector, PCB (Printed Circuit Board, printed circuit board) is used in almost all electronic products and is considered to be the "mother of electronic system products". There are currently two obvious trends in electronic products, one is light, thin and small, and the other is high speed and high frequency, which accordingly drives downstream PCBs to develop in the direction of high density, high integration, encapsulation, miniaturization and multi-layer. Board and HDI (High Density Interconnect, high-density interconnect) demand is increasing. High multi-layer boards have short wiring lengths, low circuit impedance, high-frequency and high-speed operation, stable performance, and can undertake more complex functions. In particular, the in-depth application o...

AI Technical Summary

Problems solved by technology

At present, the general HDI in the industry can achieve a depth ratio of plating capacity of about 1:1, and some can reach 1.2:1. However, due to the limitation of the exchange capacity of blind hole electroplating chemicals, when the depth ratio exceeds 1.2:1, the electroplating metallization of blind holes Become a bottleneck, restricting HDI technology to achieve more levels of interconnection under a relatively simple process flow

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