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A test device and test method

A test device and socket technology, which is applied in the direction of measuring device, measuring device casing, single semiconductor device testing, etc., can solve problems such as unstable contact between the object to be measured and the probe, damage to the object to be measured and the probe, and achieve sensitivity Guaranteed, wear-resistant, spill-proof effects

Active Publication Date: 2021-05-14
FTDEVICE TECH (SUZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical solution of the present invention is: a test device and a test method, which are used to solve the existing problems of damage to the object to be tested and the probe and unstable contact between the object to be tested and the probe

Method used

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  • A test device and test method
  • A test device and test method
  • A test device and test method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] Such as Figure 1-8 As shown, a probe testing device in this embodiment includes a probe 1 , a socket 2 , a support frame 3 , and a test member 5 .

[0046] The probe 1 is arranged in the socket 2, the socket 2 is fixed between the object 4 to be measured and the test member 5 through the support frame 3, the lower end surface of the object 4 to be measured is electrically connected to the upper end of the probe 1 installed in the socket 2, The lower end of the probe 1 is electrically connected with the test member 5 through the socket 2 .

[0047] The socket 2 can be detachably installed on the support frame 3, and the position of the socket 2 can be adjusted by controlling the support frame 3 through the driver. At the same time, the socket can be fixed, and the object 4 to be measured is set on a device that can be adjusted and fixed. To satisfy the fixing and moving of the object 4 to be measured.

[0048] When the object to be measured is moved by the instrument,...

Embodiment 2

[0063] A socket disclosed in this embodiment includes: an upper unit 2-1, a spacer 2-2, a first cover 2-3, a lower unit 2-4, a second cover 2-5, and a connector 2- 6.

[0064] Both the upper unit 2-1 and the lower unit 2-4 are square tubes with cuboid cavities inside to fully adapt to the shape of the columnar tube 1-1. The columnar tube 1-1 is square.

[0065] The upper unit 2-1 is provided with a spacer 2-2 inside, and the top of the upper unit 2-1 is provided with a first cover plate 2-3, and the opening end of the upper unit 2-1 is correspondingly connected with one end of the lower unit 2-4 . The other end of the lower unit 2-4 is provided with a second cover plate 2-5, and the lower end of the second cover plate 2-5 is provided with a connecting piece 2-6.

[0066] The upper unit 2-1 and the lower unit 2-4 have corresponding grooves on the inner wall of the corresponding connection opening, and the cylindrical pipe 1-1 is arranged on the upper unit 2-1 and the lower un...

Embodiment 3

[0075] A test method, comprising the following steps;

[0076] Step a, the point to be measured, selecting the electrical contact 4-1 to be measured on the object 4 to be measured for marking;

[0077] Step b, forming a closed circuit, the installed socket, by fine-tuning the support frame 3 so that the funnel-shaped tube 1-10 is aligned with the electrical contact 4-1 to be tested, and at the same time make the sealing ring 1-11 and the lower part of the object 4 to be tested The surface is fully attached, and the wiring board 5-2 is pushed upward by the driver, so that the lower end of the second column end 1-5 is completely against the welding pad 5-3, and reaches the upper end of the liquid holding tube 2-6-1 Abut against the lower end surface of the second cover plate 2-5, so that the lower end of the liquid holding pipe 2-6-1 and the upper end surface of the welding pad 5-3 form a closed space for liquid injection to form a preliminary closed circuit;

[0078] Step c, i...

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Abstract

The invention discloses a test device and a test method, which relate to the technical field of semiconductors and solve the existing problems of contact damage between an object to be tested and a probe, and unstable contact between an object to be tested and a probe. It specifically includes: a test probe, a test socket, a support frame and a test member; the test probe is arranged in the test socket, the lower end surface of the object to be measured is abutted against the upper end of the test probe installed in the test socket, and the test probe The lower end is electrically connected to the test member through the test socket; the test probe includes a cylindrical tube, a positioning ring, a first column end, a spring, a second column end, a sleeve, a screw nut, a liquid storage tube, a piston, and a funnel-shaped tube , blanking ring, conductive fluid and retaining sleeve. The invention effectively protects the object to be measured and the test probe, and at the same time satisfies the requirement of more accurate and effective measurement.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a testing device and a testing method. Background technique [0002] Semiconductor devices that undergo complex processes are subjected to various types of electrical tests to test their characteristics and their defects. For this purpose, the metal wires or contact pads of the test board (printed circuit board) installed in the test equipment and the external terminals of the device under test (semiconductor package) are electrically connected by means of sockets and probes. [0003] For example, the Chinese invention patent "probe module and socket", the application number is CN201880068269.X, a probe module. Including: a conductive tube; a probe, which is inserted into the tube in a non-contact manner and elastically stretchable along the length direction; and an insulating probe support member, configured to support the probe between the inner wall of the tube and the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26G01R1/067G01R1/04
CPCG01R1/0408G01R1/06711G01R31/2601G01R31/2637
Inventor 金永斌贺涛丁宁朱伟
Owner FTDEVICE TECH (SUZHOU) CO LTD
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