Packaging mechanism and packaging method of circuit board

Abstract

The invention discloses a packaging mechanism and a packaging method of a circuit board. The packaging mechanism comprises a supporting frame, a sealing unit, a packaging adhesive extruding unit, a transverse moving unit, an adhesive coating unit, a circuit board tray, a tray fixing and residual adhesive collecting unit and a longitudinal sliding rail movable power unit. The supporting frame comprises a top plate, supporting columns and a bottom plate, wherein the four corners of the bottom of the top plate are connected with the four corners of the top of the bottom plate through the four supporting columns, the sealing unit is installed on the periphery of the supporting frame to enable the interior of the supporting frame to form a closed space, and the transverse moving unit is transversely installed in the middle of the bottom of the top plate; the gluing unit is mounted at the bottom of the transverse moving unit. According to the invention, the circuit board trays of different sizes can be fixed for different types of circuit boards, excessive glue can be prevented from being scattered by the gluing roller, excessive glue liquid outside the sizes of the circuit boards can becollected, waste is avoided, cleaning steps are reduced, and the use efficiency is improved.

Description

Technical field[0001]The invention relates to the technical field of circuit board packaging, in particular to a circuit board packaging mechanism and packaging method.Background technique[0002]The circuit board can be called a printed circuit board or a printed circuit board. Packaging refers to connecting the circuit pins on the silicon chip to external joints with wires to facilitate the connection of other devices. The package form refers to the housing for mounting semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connecting to the pins of the package shell with wires through the contacts on the chip, and these pins pass the wires on the printed circuit board. Connect with other devices to realize the connection between the internal chip and the external circuit. During the gluing process before packaging, the size of the circuit board is changeable, so it i...

AI Technical Summary

Problems solved by technology

In the gluing process before packaging, due to the variable size of the circuit board, it is necessary to deal with the variable type of circuit board in the gluing mechanism, thus causing a waste of resources, and the size of the gluing roller in the gluing process Inconsistencies will also cause excess packaging glue outside the circuit board, resulting in waste, and need to be cleaned, making it inconvenient to use

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