Packaging mechanism and packaging method of circuit board

A technology of circuit boards and encapsulation adhesives, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve the problems of resource waste, waste, and different sizes, and achieve the goal of reducing cleaning steps, avoiding waste, and improving use efficiency Effect

Inactive Publication Date: 2021-02-05
简思涛
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the gluing process before packaging, due to the variable size of the circuit board, it is necessary to deal with the variable type of circuit board in the gluing mechanism, thus causing a waste of resources, and the size of the gluing roller in the gluing process Inconsistencies will also cause excess packaging glue outside the circuit board, resulting in waste, and need to be cleaned, making it inconvenient to use

Method used

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  • Packaging mechanism and packaging method of circuit board
  • Packaging mechanism and packaging method of circuit board
  • Packaging mechanism and packaging method of circuit board

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Embodiment Construction

[0043]The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0044]Seefigure 1 ,Figure 5-7 ,Picture 9 , This embodiment provides a technical solution: a circuit board packaging mechanism, including a support frame 1, a sealing unit 2, a packaging glue extrusion unit 3, a lateral movement unit 5, a glue application unit 6, a circuit board tray 7, a tray Fixed and residual glue collection unit 8 and vertical slide rail movable power unit 9;

[0045]The supporting frame 1 includes a top plate 11, a pillar 12 a...

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Abstract

The invention discloses a packaging mechanism and a packaging method of a circuit board. The packaging mechanism comprises a supporting frame, a sealing unit, a packaging adhesive extruding unit, a transverse moving unit, an adhesive coating unit, a circuit board tray, a tray fixing and residual adhesive collecting unit and a longitudinal sliding rail movable power unit. The supporting frame comprises a top plate, supporting columns and a bottom plate, wherein the four corners of the bottom of the top plate are connected with the four corners of the top of the bottom plate through the four supporting columns, the sealing unit is installed on the periphery of the supporting frame to enable the interior of the supporting frame to form a closed space, and the transverse moving unit is transversely installed in the middle of the bottom of the top plate; the gluing unit is mounted at the bottom of the transverse moving unit. According to the invention, the circuit board trays of different sizes can be fixed for different types of circuit boards, excessive glue can be prevented from being scattered by the gluing roller, excessive glue liquid outside the sizes of the circuit boards can becollected, waste is avoided, cleaning steps are reduced, and the use efficiency is improved.

Description

Technical field[0001]The invention relates to the technical field of circuit board packaging, in particular to a circuit board packaging mechanism and packaging method.Background technique[0002]The circuit board can be called a printed circuit board or a printed circuit board. Packaging refers to connecting the circuit pins on the silicon chip to external joints with wires to facilitate the connection of other devices. The package form refers to the housing for mounting semiconductor integrated circuit chips. It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connecting to the pins of the package shell with wires through the contacts on the chip, and these pins pass the wires on the printed circuit board. Connect with other devices to realize the connection between the internal chip and the external circuit. During the gluing process before packaging, the size of the circuit board is changeable, so it i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 简思涛
Owner 简思涛
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