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MEMS device

A technology for equipment and connection wiring, which is applied in the direction of microelectronic microstructure devices, electrical components, microstructure devices, etc., and can solve the problems of unrealized eutectic reaction and unstable electrical connection of the connection part, etc.

Pending Publication Date: 2021-02-05
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when the metal disposed on the upper substrate and the metal disposed on the upper substrate are eutectically bonded, the metal on the upper substrate may diffuse along the connection wiring extending from the connection portion.
As a result, the metal of the upper substrate diffused from the connection portion affects the elements of the lower substrate, or the amount of metal on the upper substrate at the connection portion decreases, so that the eutectic reaction is not achieved and the electrical connection of the connection portion is not achieved. become unstable

Method used

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Embodiment Construction

[0025] Embodiments of the present invention will be described below. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be construed as this embodiment.

[0026]

[0027] First, refer to figure 1 as well as figure 2 , a schematic structure of a resonator device 1 according to an embodiment of the present invention will be described. figure 1 It is a perspective view schematically showing the appearance of the resonator device 1 according to one embodiment of the present invention. figure 2 is a schematic representation figure 1 An exploded perspective view of the structure of the resonator device 1 shown.

[0028] The resonator device 1 includes a lower cover 20 , a resonator 10 (hereinafter, the lower cover 20 and the resonator 10 are also c...

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Abstract

Provided is a MEMS device that can mitigate the spread, through a connecting wire, of some metal from a eutectic alloy constituting a connecting section. A resonance device 1 comprises: a MEMS substrate 50 that includes a resonator 10 and a connecting wire 75 that is electrically connected to the resonator 10; and a connecting section 70 that is electrically connected to the connecting wire 75, and that is constituted of a eutectic alloy of a first metal layer 71 and a second metal layer 72 that is provided on the MEMS substrate 50 side. When the main surface of the MEMS substrate 50 is viewedin plan view, a wire width WL of the connecting wire 75 is less than a width WC of the connecting section.

Description

technical field [0001] The present invention relates to MEMS devices. Background technique [0002] Conventionally, devices manufactured using MEMS (Micro Electro Mechanical Systems: Micro Electro Mechanical Systems) technology have been widely used. This device is formed, for example, by bonding an upper substrate to a lower substrate having a resonator (piezoelectric body). [0003] For example, Patent Document 1 discloses a MEMS device including a lower substrate having an element (resonator), an upper substrate provided to face the element, and a lower substrate and an upper substrate bonded around the element. The bonding portion of the substrate has a region containing a hypereutectic alloy and a region containing a eutectic alloy. The MEMS device prevents metal from protruding from the joint surface of the eutectic bond by covering the eutectic alloy with the hypereutectic alloy. [0004] Patent Document 1: International Publication No. 2017 / 047663 [0005] Howeve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/24
CPCH03H9/2489H03H9/1057H03H9/0595B81B7/0006B81B2201/0271B81B7/0038B81B2207/07H03H9/02259H03H9/2457
Inventor 井上义久福光政和后藤雄一
Owner MURATA MFG CO LTD