Automatic solar silicon wafer cutting machine

Abstract

The invention relates to the technical field of mechanical equipment, in particular to an automatic solar silicon wafer cutting machine which can effectively improve the flatness of the section of a silicon wafer and improve the cutting quality by automatically cutting the silicon wafer, and meanwhile, the silicon wafer is subjected to one-way cutting treatment by adopting laser, so that the stability of the equipment during operation can be effectively improved, the stability of the silicon wafer is improved, the influence of equipment vibration on silicon wafer cutting work is reduced, the cutting precision is improved, and the practicability and reliability are improved; and the automatic solar silicon wafer cutting machine comprises a base, a workbench, two groups of first linear guiderails, two groups of first sliding blocks, an annular guide rail and an annular sliding groove, the workbench is installed on the base, the two groups of first linear guide rails are transversely installed on the front side and the rear side of the top of the workbench correspondingly, and the two groups of first sliding blocks are slidably installed on the two groups of first linear guide railscorrespondingly.

Description

technical field [0001] The invention relates to the technical field of mechanical equipment, in particular to an automatic solar silicon wafer cutting machine. Background technique [0002] As we all know, solar silicon wafers are mainly the basic components of solar panels, which play a major role in the conversion of solar energy into electrical energy by solar panels. Solar silicon wafers usually need to be cut into specified sizes during production to facilitate installation. The current cutting method of solar silicon wafers is mainly through wire cutting machine. When using this equipment, the flatness of the cutting surface of silicon wafers is poor, and the cutting quality is low. The vibration amplitude is relatively large, and the vibration is easily transmitted to the silicon wafer and affects its cutting accuracy. Contents of the invention [0003] In order to solve the above technical problems, the present invention provides an automatic cutting process for s...

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Problems solved by technology

[0002] As we all know, solar silicon wafers are mainly the basic components of solar panels, which play a major role in the conversion of solar energy into electrical energy by solar panels. Solar silicon wafers usually need to be cut into specified sizes during production to facilitate installation. The current cutting method of solar silicon wafers is mainly through wire cutting machine. When using this equipment, the flatness of the cutting surface of silicon wafers is poor, and the cutting quality is low. The vibration amplitude is relatively large, and the vibration is easily transmitted to the silicon wafer and affects its cutting accuracy

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