High-repeatability position identification method and device for laser diode chip

A laser diode, repeatable technology, applied in the field of laser diode chip high-repeat position recognition, can solve the problem that the mechanical suction cup cannot drop the chip and other problems, and achieve the effect of easy and fast maintenance, improved accuracy and simple structure

Pending Publication Date: 2021-02-09
武汉智汇芯科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a method and device for high-repeatability position recognition of laser diode c

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  • High-repeatability position identification method and device for laser diode chip
  • High-repeatability position identification method and device for laser diode chip
  • High-repeatability position identification method and device for laser diode chip

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-5 , an embodiment of the present invention provides a technical solution: a method for high-repeatability position recognition of a laser diode chip, specifically comprising the following steps:

[0031] Step 1: Basic positioning operation: Rotate the adjustment disc 32, and the position display block 33 and the connecting plate 34 are driven by the rotation of the manual screw 31, thereby driving the restriction block 35 to move to a prop...

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Abstract

The invention discloses a high-repeatability position identification method for a laser diode chip. The method specifically comprises the following steps of 1, basic positioning operation, 2, advancedpositioning operation and 3, the basic operation of a device, and relates to the technical field of chips. According to the high-repeatability position identification method and device for the laserdiode chip, the device can be manually adjusted by a worker, a manual screw can drive a position display block to move to an accurate position, and meanwhile, a certain angle is formed in the surfaceof a limiting block, so that the chip can conveniently fall onto the surface of the limiting block in time when a working telescopic rod extends, and can automatically fall onto the surface of the limiting block along with the limiting block; and through the arrangement of a position marking device, the whole device can drive a positioning head to move to a related accurate position by moving a horizontal top plate leftwards and rightwards, and a clamping plate in the device can be pushed by a reset spring to be tightly fixed to the surface of the horizontal top plate, so that the operation accuracy of the device is improved.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to a method and device for high-repeatability position recognition of a laser diode chip. Background technique [0002] A chip refers to an integrated circuit that manufactures a circuit on the surface of a semiconductor chip, also known as a thin film integrated circuit. Another kind of thick film integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or circuit board. Integrated circuits have two main advantages over discrete transistors: cost and performance. The low cost is due to the fact that the chip has all its components printed as a unit by photolithography, rather than making only one transistor at a time. The high performance is due to the fast switching of components and lower energy consumption because the components are small and close to each other. In 2006, the chip area ranged f...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/68H01L21/683H01S5/02
CPCH01L21/67265H01L21/67294H01L21/68H01L21/6838H01S5/0206
Inventor 鲁晓东余凯
Owner 武汉智汇芯科技有限公司
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