Wafer powder wiping machine and powder wiping mechanism thereof

Abstract

The invention provides a wafer powder wiping machine and a powder wiping mechanism thereof, and belongs to the technical field of semiconductor element manufacturing equipment. The wafer powder wipingmachine comprises a planetary gear set and a strong magnet used for connecting filter paper special for powder wiping; the strong magnet is arranged on the lower end surface of the planetary gear set, and the planetary gear set is used as a transmission mechanism; a strong magnet used for being connected with filter paper special for wiping powder is arranged on the lower end face of the planetary gear set, so that part of the filter paper special for wiping powder can revolve around the center and part of the filter paper can rotate around the center of the filter paper, and the powder wiping effect is better.

Description

technical field [0001] The present application relates to the technical field of semiconductor element manufacturing equipment, in particular, to a wafer wiper and its wiper mechanism. Background technique [0002] GPP (Glassivation Passivation Parts) diode chip, that is, glass passivation diode chip, is based on the existing ordinary silicon rectifier diffusion sheet, and a layer of glass is sintered around the P / N junction surface of the tube core to be divided, so that the P / N The N-junction is best protected from the intrusion of the external environment and the stability of the diode chip is improved. After the GPP diode chip is sintered with a layer of glass on its P / N junction surface, the glass needs to be passivated. Before the passivation treatment, the glass powder on the surface of the glass needs to be wiped off, otherwise the passivation effect of the glass will be seriously affected and the performance of the diode chip will deteriorate. [0003] At present, ...

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Problems solved by technology

[0002] GPP (Glassivation Passivation Parts) diode chip, that is, glass passivation diode chip, is based on the existing ordinary silicon rectifier diffusion sheet, and a layer of glass is sintered around the P / N junction surface of the tube core to be divided, so that the P / N The N-junction is best protected from the intrusion of the external environment and the stability of the diode chip is improved. After the GPP diode chip is sintered with a layer of glass on its P / N junction surface, the glass needs to be passivated. Before the passivation treatment, the glass powder on the glass surface needs to be wiped off, otherwise the passivation effect of the glass will be seriously affected, and the performance of the diode chip will be deteriorated

[0003] At present, the powder wiping operation before glass passivation of GPP diode chips is manual dusting, as described in Chinese patent application CN201611183968.8, using an eraser to gently and flatly wipe off the glass powder by hand, but manual dusting is done by hand after all. To achieve this, the dusting objects are fragile products such as glass, and the dusting strength of each worker is different during the operation process. Correspondingly, there are also differences in the cleanliness of the glass dusting, which makes the yield of the product unsatisfactory. It is well controlled, and the manual dusting operation can easily lead to an increase in the scrap rate of diode chip production

In addition, the efficiency of manual dusting operation is low, which cannot meet the increasing demand for GPP diode chips, and completing the powdering process by manual operation will also lead to an increase in the production cost of GPP diode chips, which will eventually reduce the production cost of GPP diode chips. Advantages in price

In addition, the manual dusting operation requires a lot of materials, the processing steps are complicated, the protection measures are simple, and the operating space cannot be 100% closed. Glass dust is very easy to float and spread outward, causing dust pollution to the surrounding environment. The dust pollution will It will cause health hazards to operators, and will also enter the diode chip production equipment to affect the normal operation of the equipment; dust floating will also bring safety hazards of explosion and fire to the operation workshop

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