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Single-chip microcomputer thinning machining equipment

A technology of processing equipment and single-chip microcomputer, which is applied in the field of single-chip microcomputer thinning processing equipment, can solve problems such as single-chip microcomputer tilting and single-chip microcomputer defects, and achieve the effect of avoiding tilting

Inactive Publication Date: 2021-02-23
广州优易机械科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on the discovery of the inventors above, the existing single-chip microcomputer thinning processing equipment mainly has the following shortcomings, such as: the single-chip microcomputer will produce a large amount of debris when it is thinned, and the debris will follow the rotation of the turntable from the top of the single-chip microcomputer. The end surface falls off and falls on the support seat. When the debris falls into the placement slot of the single-chip microcomputer, the thinned single-chip microcomputer placed in the placement slot behind will be tilted, causing the turntable to grind the end face of the single-chip microcomputer, which will make the single-chip microcomputer The end face is polished into a bevel, which causes defects in the processed single-chip microcomputer

Method used

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  • Single-chip microcomputer thinning machining equipment
  • Single-chip microcomputer thinning machining equipment
  • Single-chip microcomputer thinning machining equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Example 1: Please refer to Figure 1-Figure 5 , the specific embodiments of the present invention are as follows:

[0025] Its structure includes a lifting base 1, a control panel 2, a support base 3, and a turntable 4. The front end of the lift base 1 is provided with a control panel 2, and the support base 3 is arranged at the bottom front end of the lift base 1. The turntable 4 is installed At the bottom of the control panel 2, the support seat 3 includes a base 31, a placement groove 32, a support device 33, and a chip removal groove 34. The top of the base 31 is provided with a placement groove 32 in the middle, and the support device 33 is provided with There are two, and they are located at both ends of the bottom of the placement groove 32 respectively. The chip removal groove 34 is located at the bottom of the inner end of the base 31 and is connected to the bottom of the placement groove 32 .

[0026] The supporting device 33 includes a movable groove 331, a ...

Embodiment 2

[0030] Example 2: Please refer to Figure 6-Figure 7 , the specific embodiments of the present invention are as follows:

[0031] The material guide a5 includes a fixed plate a51, a sliding groove a52, a tension spring a53, a brush handle a54, and a sliding block a55. The end of the fixed plate a51 is provided with a sliding groove a52, and the inner two ends of the sliding groove a52 A tension spring a53 is provided, the brush handle a54 is engaged with the end of the fixed plate a51, the sliding block a55 is embedded in the front end of the brush handle a54, and the sliding block a55 cooperates with the tension spring a53 to facilitate The brush handle a54 is driven to be flush with the fixed plate a51 by two tension springs a53 reset.

[0032]The brush handle a54 includes a mounting seat b1, a rotating groove b2, a pulley b3, a connecting rod b4, and a brush b5. The side end of the mounting seat b1 is provided with a rotating groove b2, and the rotating groove b2 is annula...

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Abstract

The invention discloses single-chip microcomputer thinning machining equipment. The single-chip microcomputer thinning machining equipment structurally comprises a lifting base, a control panel, a supporting base and a rotary disc, wherein the control panel is arranged at the front end of the lifting base, the supporting base is arranged at the front end of the bottom of the lifting base, the rotary disc is installed at the bottom end of the control panel, the supporting base comprises a base, a placing groove, a supporting device and a scrap discharge groove, the supporting device comprises amovable groove, a trigger rotating rod, a rewinding spring, a scrap brushing device and a transmission toothed bar, and the scrap brushing device comprises rotating teeth, a mounting plate, telescopic plates, rotating shafts, material guiding devices and elastic blocks. According to the single-chip microcomputer thinning machining equipment, the fact that when a single-chip microcomputer is placed in the placing groove, the trigger rotating rod will be pressed downwards is utilized, the trigger rotating rod is made to drive a steel wire to pull the transmission toothed bar, the scrap brushingdevice can turn over upwards to brush and sweep scraps on the end face of the supporting device, the situation that the scraps are placed on the end face of the supporting device to cause inclining of the single-chip microcomputer in thinning is avoided, and the end faces of the machined single-chip microcomputers can be all flat.

Description

technical field [0001] The invention relates to the field of single-chip microcomputer processing equipment, in particular to a single-chip microcomputer thinning processing equipment. Background technique [0002] Single-chip microcomputer is a kind of integrated circuit chip. It is a small and complete microcomputer system composed of a variety of processors with data processing capabilities integrated on a silicon chip by VLSI technology. It is widely used in the field of industrial control. Thinning is required during processing, so it needs to be processed by thinning equipment specially used for single-chip microcomputers. During processing, abrasive paper is installed on the turntable to friction and thin the end face of the single-chip microcomputer. [0003] Based on the discovery of the inventors above, the existing single-chip microcomputer thinning processing equipment mainly has the following shortcomings, such as: the single-chip microcomputer will produce a la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B55/06
CPCB24B55/06
Inventor 郑文坛
Owner 广州优易机械科技有限公司