High-strength heat-conducting silicone pad

Abstract

The invention relates to the technical field of silicone pads, and discloses a high-strength heat-conducting silicone pad. The silicone pad comprises a silicone pad body and a heat-conducting rubber layer covering the upper surface of the silicone pad body, the upper surface of the heat-conducting rubber layer is covered with a first glass fiber layer, the upper surface of the first glass fiber layer is covered with a graphite layer, and the upper surface of the graphite layer is covered with a first protective layer. The lower surface of the silicone pad body is covered with a second glass fiber layer, the lower surface of the second glass fiber layer is covered with a ceramic heat dissipation layer, and the lower surface of the ceramic heat dissipation layer is covered with a second protection layer. The silicone pad disclosed by the invention has excellent mechanical strength and heat-conducting property.

Description

technical field [0001] The invention relates to the technical field of silica gel pads, in particular to a high-strength heat-conducting silica gel pad. Background technique [0002] With the development of industrial production and technology, people continue to put forward new requirements for materials. In the field of electronic appliances, due to the rapid development of integration technology and assembly technology, electronic components and logic circuits are developing in the direction of light, thin and small, and the amount of calorific fluid increases accordingly, which requires high thermal conductivity insulating materials to effectively spread to the outside world The heat generated by electronic equipment is related to the service life and quality reliability of the product. The heat dissipation methods commonly used in the past mainly include: natural cooling, ventilation or using a larger casing. As the heating area becomes wider, the heat generated is al...

AI Technical Summary

Problems solved by technology

At present, most of the heat-conducting silicone gaskets on the market have simple mechanical structures. During the collision and vibration of electronic equipment, the impact resistance is poor, and the mechanical strength needs to be improved. In addition, the heat transfer performance of silicone gaskets is average and needs to be further improved.

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