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Excessive glue cleaning device for integrated circuit board processing

A technology for integrated circuit boards and cleaning devices, applied in circuits, metal processing equipment, electrical components, etc., can solve problems such as overflowing glue, increase product scrap rate, increase circuit board damage, etc., to reduce defective products and reduce labor intensity. , the effect of improving efficiency and quality

Inactive Publication Date: 2021-02-26
郑州竹蜻蜓电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of encapsulating integrated circuit boards, encapsulation glue is required for encapsulation. However, in general colloidal encapsulation, overflowing glue is prone to occur, resulting in excess glue remaining on the circuit board, which requires people to clean it up in time, while traditional overflowing The glue treatment method is to manually clean up the residual glue, and when people are cleaning the overflow glue of the integrated circuit board package, people need to manually change the position of the integrated circuit board, thereby increasing the time for people to clean the residual glue on the circuit board. damage, increasing the scrap rate of the product

Method used

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  • Excessive glue cleaning device for integrated circuit board processing
  • Excessive glue cleaning device for integrated circuit board processing
  • Excessive glue cleaning device for integrated circuit board processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Such as Figure 1-Figure 6 As shown, a glue overflow cleaning device for integrated circuit board processing includes a supporting mechanism 1 and a fixing mechanism 2 arranged on the supporting mechanism 1 for fixing the circuit board. The glue mechanism 4, and the steering mechanism 3 that is provided with the glue removing mechanism 4 to move, the steering mechanism 3, the fixing mechanism 2 are connected with the supporting mechanism 1, and the glue removing mechanism 4 is connected with the steering mechanism 3;

[0047] The support mechanism 1 includes a box body 11, a support base 12 is provided at the corner of the lower end of the box body 11, a sinking platform 13 is provided at the upper end of the box body 11, and a fixing mechanism 2 is arranged inside the sinking platform 13;

[0048]The fixing mechanism 2 includes a suction cup 21, the lower end of the suction cup 21 is connected with an on-off valve 22 to control the on-off of the air flow, the other end...

Embodiment 2

[0053] Such as Figure 7-Figure 8 As shown, a glue overflow cleaning device for integrated circuit board processing includes a supporting mechanism 1 and a fixing mechanism 2 arranged on the supporting mechanism 1 for fixing the circuit board. The glue mechanism 4, and the steering mechanism 3 that is provided with the glue removing mechanism 4 to move, the steering mechanism 3, the fixing mechanism 2 are connected with the supporting mechanism 1, and the glue removing mechanism 4 is connected with the steering mechanism 3;

[0054] The support mechanism 1 includes a box body 11, a support base 12 is provided at the corner of the lower end of the box body 11, a sinking platform 13 is provided at the upper end of the box body 11, and a fixing mechanism 2 is arranged inside the sinking platform 13;

[0055] The fixing mechanism 2 includes a suction cup 21, the lower end of the suction cup 21 is connected with an on-off valve 22 to control the on-off of the air flow, the other en...

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Abstract

The invention discloses an excessive glue cleaning device for integrated circuit board processing. The excessive glue cleaning device for integrated circuit board processing comprises a support mechanism, a fixing mechanism arranged on the support mechanism and used for fixing a circuit board, a glue removing mechanism arranged above the fixing mechanism, and a steering mechanism arranged to movethe glue removing mechanism. The circuit board is adsorbed and fixed through a suction cup, the excessive glue cleaning device is stable in the glue removing process, the position of a laser tool bitof the glue removing mechanism is adjusted through rotation of a transverse lead screw of a transverse moving mechanism and rotation of a longitudinal lead screw of a longitudinal moving mechanism, and then through rotation of an electric telescopic rod or a vertical lead screw of a vertical moving mechanism, the height of the laser tool bit is adjusted, residual glue is cut off, meanwhile, an airpipe on one side of the laser tool bit blows up the removed residual glue after cutting off, the removed residual glue enters a waste glue groove, the circuit board can be subjected to glue removingoperation after being fixed at a time, the glue removing efficiency and quality are improved, the labor intensity of workers is relieved, and inferior-quality products of the circuit board are reduced.

Description

technical field [0001] The invention relates to the field of electronic product processing, in particular to a glue overflow cleaning device for integrated circuit board processing. Background technique [0002] An integrated circuit is a microelectronic device or component that uses a certain process to interconnect components such as transistors, resistors, capacitors, and inductors required in a circuit, and interconnects them together to form a small or several small semiconductor chips or chips. Dielectric substrate, and then packaged in a package to become a microstructure with the required circuit function. [0003] In the process of encapsulating integrated circuit boards, encapsulation glue is needed for encapsulation. However, in general colloidal encapsulation, overflowing glue is prone to occur, resulting in excess glue remaining on the circuit board, which needs to be cleaned up in time, while traditional overflowing The glue treatment method is to manually cle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C37/02B23K26/361B23K26/70H01L21/67
CPCB29C37/02B23K26/361B23K26/702H01L21/67126
Inventor 杨燕辉崔京
Owner 郑州竹蜻蜓电子科技有限公司
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