Excessive glue cleaning device for integrated circuit board processing
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 郑州竹蜻蜓电子科技有限公司
- Publication Date
- 2021-02-26
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of electronic product processing, in particular to a glue overflow cleaning device for integrated circuit board processing. Background technique
[0002] An integrated circuit is a microelectronic device or component that uses a certain process to interconnect components such as transistors, resistors, capacitors, and inductors required in a circuit, and interconnects them together to form a small or several small semiconductor chips or chips. Dielectric substrate, and then packaged in a package to become a microstructure with the required circuit function.
[0003] In the process of encapsulating integrated circuit boards, encapsulation glue is needed for encapsulation. However, in general colloidal encapsulation, overflowing glue is prone to occur, resulting in excess glue remaining on the circuit board, which needs to be cleaned up in time, while traditional overflowing The glue treatment method is to manually cle...