A pick-and-place device for automatic unloading of wafers

Abstract

The invention belongs to the technical field of wafer unloading, and provides a pick-and-place device for automatic wafer unloading, including a frame, on which a double-speed chain conveying line, a carrier positioning mechanism, a pick-and-place mechanical arm, and a cover plate are provided. Placement table and wafer placement table, the double-speed chain conveyor line is equipped with a blocking cylinder, the pick-and-place robot arm and the cover plate placement table are located on one side of the double-speed chain conveyor line, and the shaft end of the pick-and-place robot arm is equipped with a pick-and-place material Mechanism, the wafer placement table is located at one end of the double-speed chain conveyor line; the pick-and-place mechanism includes a mounting frame installed on the working axis of the pick-and-place robotic arm, and a Bernoulli suction cup driven by a pick-up cylinder is installed on the mounting frame, and the bottom of the mounting frame A suction nozzle mounting plate is also installed, and several cover plate suction nozzles are installed at the bottom of the suction nozzle mounting plate. Compared with the traditional method of manually unloading the wafer, the present invention not only greatly improves the efficiency of wafer unloading, but also effectively avoids the occurrence of accidental scratches on the wafer during the wafer unloading process, ensuring the quality and safety of the wafer during the wafer unloading process. Pass rates are not affected.

Description

technical field [0001] The invention relates to the technical field of wafer unloading, in particular to a pick-and-place device for automatic wafer unloading. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. During the production and processing of wafers, according to the requirements of the processing technology, the wafers need to be arranged and placed in the wafer tray, and then the entire tray carrying the wafers is placed in a plasma etching machine for ICP etching. After the ICP etching process, the wafers are sequentially taken out from the wafer tray for subsequent AFM tests, etc. The process of taking the wafer out of the wafer tray is called wafer unloading. [0003] At present, the unloading operation of wafers in the tray is usually done manually. When unloading, the cover plate is first removed from the carrier plate, and then the wafers...

AI Technical Summary

Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is to provide a pick-and-place device for automatic unloading of wafers to solve the time-consuming and labor-intensive task of picking up slices during manual unloading, the efficiency of picking up slices is low, and the wafers are easy to be scratched. Technical Issues Affecting Wafer Quality

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