an automatic unloader

Abstract

The invention belongs to the technical field of wafer unloading, and provides an automatic unloading machine, which includes a frame on which a double-speed chain conveying line, a first carrier positioning mechanism, an automatic screw unloading mechanism, and a second carrier positioning mechanism are provided. Mechanism, pick-and-place robotic arm, cover placement table, wafer placement table, and carrier lifting mechanism; the first carrier positioning mechanism, the second carrier positioning mechanism, and the carrier lifting mechanism along the conveying direction of the double-speed chain conveyor line Set up in sequence, the automatic screw down mechanism corresponds to the first carrier positioning mechanism, the pick-and-place robot arm and the cover plate placement platform correspond to the second carrier positioning mechanism, and the end of the working shaft of the pick-and-place robot arm is equipped with a pick-and-place mechanism , the wafer placement table is located at the discharge end of the double-speed chain conveyor line, and the discharge end of the double-speed chain conveyor line is also equipped with a carrier transfer mechanism. The invention can realize automatic unloading of the wafer, not only greatly improves the unloading efficiency, but also effectively avoids the phenomenon of accidentally scratching the wafer during the unloading process, ensuring that the quality and pass rate of the wafer are not affected.

Description

technical field [0001] The invention relates to the technical field of wafer unloading, in particular to an automatic unloading machine. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. During the production and processing of wafers, according to the requirements of the processing technology, the wafers need to be arranged and placed in the wafer tray, and then the entire tray carrying the wafers is placed in a plasma etching machine for ICP etching. After the ICP etching process, the wafers are sequentially taken out from the wafer tray for subsequent AFM tests, etc. The process of taking the wafer out of the wafer tray is called wafer unloading. [0003] At present, the unloading operation of wafers in the tray is usually done manually. Since the cover plate is fixed on the carrier plate by a number of screws, when unloading, the screws need to be re...

AI Technical Summary

Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is to provide an automatic unloading machine to solve the current manual unloading method, which is time-consuming and laborious to remove screws and pick and place wafers, the unloading efficiency is low, and it is easy to scratch the wafer. round, technical issues affecting wafer quality

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