Rapid polishing and grinding equipment for circular semiconductor materials

Abstract

The invention relates to the technical field of semiconductor materials, and discloses rapid polishing and grinding equipment for circular semiconductor materials. The equipment comprises a fixing frame; a workbench is movably connected with the upper portion of the fixing frame; and a rotating wheel is movably connected with the upper portion of the workbench. Four clamping jaws can fixedly clampand release the circular materials through the cooperation of an ejecting rod, pushing plates, a push rod, a hinge rod, a toothed plate, a positioning gear, and a transmission gear; when the push rodcontinues to descend, the materials can be pressed on the workbench through an arc-shaped pressing block, so that grinding and polishing are facilitated; the polishing and grinding process and the feeding process can be conducted at the same time through the action of the upper set of push plates, the lower set of push plates and the push rod; and through the cooperation of an electromagnetic push block, a moving rod and a clamping block, a ratchet wheel can drive the ejecting rod or the whole rotating wheel to rotate together, so that the switching of the upper set of clamping jaws and the lower set of clamping jaws is facilitated, the repeated feeding time in the polishing and grinding process is saved, the working efficiency is improved, and the practicability of the equipment is further improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor materials, in particular to a circular semiconductor material rapid polishing equipment. Background technique [0002] Semiconductors refer to materials whose conductivity is between conductors and insulators at room temperature. Semiconductor materials are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Most electronic products, such as The core units in computers, mobile phones or digital recorders are all closely related to semiconductors. [0003] Polishing is required in the production process of semiconductor materials, but the existing polishing equipment, the blanking and polishing process is carried out step by step, requiring two sets of equipment to cooperate to complete, the equipment structure is complex, and it lacks dust treatment devices, which is not easy to clean...

AI Technical Summary

Problems solved by technology

[0003] Polishing is required in the production process of semiconductor materials, but the existing polishing equipment, the blanking and polishing process is carried out step by step, requiring two sets of equipment to cooperate to complete, the equipment structure is complex, and it lacks dust treatment devices, which is not easy to clean and maintain , long feeding time, waste of time and low grinding efficiency

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