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Lead-free low-temperature tin-based alloy soldering lug

A technology of tin-based alloys and low-temperature alloys, applied in welding media, welding equipment, metal processing equipment, etc., can solve the problems of poor reliability and low service temperature of solder joints, and achieve the effect of simplifying fusion and reducing the preparation process

Pending Publication Date: 2021-03-09
云南锡业集团(控股)有限责任公司研发中心
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of poor interface reliability of single low-temperature solder solder joints and low service temperature of solder joints, the present invention provides a lead-free low-temperature tin-based alloy solder sheet, which is composed of multiple solder sheet layers to form an interconnected whole The target alloy composition, target alloy melting temperature, solder joint service temperature, etc. can be designed according to the proportion of the high / low temperature alloy layer of the solder piece to meet the requirements of low temperature reflow soldering. It integrates the multi-component solder alloying and welding process, and the formed The remelting temperature of the solder joints of the new composition alloy is higher than the solidus temperature of the solder sheet, and the solder joints meet the requirements of high temperature service

Method used

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Examples

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Embodiment 1

[0031] Embodiment 1: The lead-free tin-based alloy solder sheet in this embodiment consists of five layers of solder sheet, including the middle high-temperature tin-based alloy layer, the composition gradient metal layer located on both sides of the high-temperature tin-based alloy layer, and the composition gradient metal layer located on both sides of the high-temperature tin-based alloy layer. The low-temperature alloy layers on both sides of the layer, among which, the middle high-temperature tin-based alloy layer is Sn-3Ag-0.5Cu, and its solidus temperature is 218.2°C; the low-temperature alloy layer is Sn-52In eutectic alloy, and its solidus temperature is 120.1℃; the total thickness of the solder piece is 1.0 mm, and its structure is as follows figure 2 As shown; the thickness of the high-temperature tin-based alloy layer is 685µm, accounting for 68.5% of the total volume of the solder piece;

[0032] Solid-solid diffusion occurs between the low-temperature Sn-52In eu...

Embodiment 2

[0035] Embodiment 2: The lead-free tin-based alloy solder sheet is composed of five layers of solder sheet, including the middle high-temperature tin-based alloy layer, the composition gradient metal layer located on both sides of the high-temperature tin-based alloy layer, and the composition gradient metal layer located on both sides of the composition gradient change metal layer. The low-temperature alloy layer on the side, in which the middle high-temperature tin-based alloy layer is Sn-3Ag-0.5Cu, and its solidus temperature is 218.2°C; the low-temperature alloy layer on both sides is Sn-52In eutectic alloy, and its solidus temperature is 120.1 ℃; the total thickness of the solder piece is 0.75mm, and its structure is as follows Figure 6 As shown; the thickness of the high-temperature tin-based alloy layer is 504µm, accounting for 67.2% of the total volume of the solder piece;

[0036] The two DSC cycle curves of the solder piece are as follows Figure 7 As shown, the so...

Embodiment 3

[0038] Embodiment 3: The lead-free tin-based alloy solder sheet consists of five layers of solder sheet, including the middle high-temperature tin-based alloy layer, the composition gradient metal layer located on both sides of the high-temperature tin-based alloy layer, and the composition gradient metal layer located on both sides of the composition gradient change metal layer. The low-temperature alloy layer on the side, wherein the middle high-temperature tin-based alloy layer is Sn-0.7Cu, and its solidus temperature is 227.9°C; the low-temperature alloy layer on both sides is Sn-52In eutectic alloy, and its solidus temperature is 120.1°C; The total thickness of the solder tab is 0.75 mm, and its structure is as follows Figure 8 As shown; the thickness of the high-temperature tin-based alloy layer is 409µm, accounting for 54.5% of the total volume of the solder piece;

[0039] The two DSC cycle curves of the solder piece are as follows Figure 9 As shown, the solidus tem...

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Abstract

The invention provides a lead-free low-temperature tin-based alloy soldering lug. The lead-free low-temperature tin-based alloy soldering lug comprises a high-temperature tin-based alloy layer in themiddle, component gradient change metal layers located on the two sides of the high-temperature tin-based alloy layer and low-temperature alloy layers located on the outer sides of the component gradient change metal layers. In the low-temperature backflow process of the lead-free low-temperature tin-based alloy soldering lug, after the low-temperature alloy layers are melted firstly, liquid-soliddiffusion is conducted, so that the component gradient change metal layers and the high-temperature tin-based alloy layer are melted, finally, a new component alloy with the solidus temperature higher than that of the low-temperature alloy layers is formed through mixing, and soldering spots are formed. The soldering lug reflow soldering peak temperature is lower than the high-temperature singlealloy soldering lug reflow soldering temperature, and the low-temperature soldering requirement is met; and meanwhile, the solidus temperature of the soldering spots formed after soldering is increased, and the high-temperature service use requirement is met. The soldering lug can be applied to the field of low-temperature soldering and high-temperature service application or used for being matched with a secondary low-temperature reflow and repair soldering process.

Description

technical field [0001] The invention relates to a lead-free low-temperature tin-based alloy solder sheet, which belongs to the technical field of materials for welding electronic devices. Background technique [0002] With the development of the microelectronics industry, the micro-pitch, three-dimensional and systematic assembly of components, and the trend of soft, small, light, thin and multi-functional chips are developing. Soldering defects such as poor HOP (Head-On-Pillow) and NWO (Non-Contact Open) caused by conventional tin-silver-copper (SAC) or tin-copper alloy solder due to excessive temperature are becoming more and more prominent. Accuracy and heat dissipation, thermal temperature put forward more stringent requirements. The soldering temperature of commonly used tin-based lead-free soldering materials is usually above 220 °C, and in the case of insufficient temperature resistance of the device, multi-temperature graded soldering, and brazing of temperature-sen...

Claims

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Application Information

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IPC IPC(8): B23K35/14B23K35/26
CPCB23K35/0238B23K35/262
Inventor 彭巨擘蔡珊珊罗晓斌
Owner 云南锡业集团(控股)有限责任公司研发中心
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