Automatic adhesive tape binding device for wafer packaging box assembly line

Abstract

The invention discloses an automatic adhesive tape binding device for a wafer packaging box assembly line. The device comprises an overall rack, a rotary lifting transversely-moving conveying belt, anadhesive tape fixing device, an adhesive tape rotation driving device, a pressing device, a movable rack, a lifting device, a cantilever device and an adhesive tape head taking and adhering device. The lifting device is fixed to the overall rack, the movable rack is installed at the movable end of the lifting device, and the lifting device drives the movable rack to do linear motion in the vertical direction. The rotary lifting transversely-moving conveying belt is used for fixedly supporting a wafer packaging box and driving the wafer packaging box to rotate, and the rotary lifting transversely-moving conveying belt is fixed to the overall rack. The adhesive tape fixing device, the adhesive tape rotation driving device, the pressing device and the cantilever device are all installed on the movable rack, and the adhesive tape head taking and adhering device is installed on the cantilever device. Automatic adhesive tape winding work of wafer packaging box packaging bags can be achieved, the adhesive tape winding efficiency is high, the whole process is conducted in a full-automatic mode, and the labor cost is reduced.

Description

technical field [0001] The invention relates to the field of wafer packaging box packaging, and more specifically, to an automatic tape wrapping device for a wafer packaging box assembly line. Background technique [0002] Wafer refers to a silicon chip made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A wafer is a carrier used in the production of integrated circuits. A wafer in the general sense basically refers to It is a single crystal silicon wafer. The single crystal silicon wafer is refined from ordinary silicon sand. After being dissolved, purified, and distilled, it supports a single crystal silicon rod. After the single crystal silicon rod is polished and sliced, it becomes a wafer. With the continuous development of integrated circuit manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnection layers is increasing, and the diameter of the wafer is also in...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that the automation degree of tape wrapping on the surface of the packaging bag of the existing wafer packaging box is not high, and the tape head is difficult to find. An automatic tape wrapping device for the wafer packaging box assembly line is proposed, which can automatically realize The tape winding work on the surface of the packaging bag of the round packaging box has high work efficiency, and it can automatically find the tape head, which is convenient for the entire tape winding work.

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