A semiconductor wafer surface cleaning device

A surface cleaning and semiconductor technology, applied in the direction of cleaning methods using liquids, cleaning methods and utensils, and cleaning methods using tools, etc., can solve poor cleaning effects, easy residual impurities on the wafer surface, and consume more manpower and time, etc. question

Active Publication Date: 2022-06-24
浙江汇隆晶片技术有限公司
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  • Abstract
  • Description
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Problems solved by technology

[0002] As we all know, a semiconductor wafer is mainly an electronic auxiliary component composed of silicon, which is usually a thin sheet. When the wafer is processed and produced with electronic components, it is necessary to clean up the impurities attached or remaining on the surface of the wafer, so as to ensure The cleanliness of the wafer surface prevents impurities from polluting and damaging the electronic components. The existing cleaning method is mainly for workers to clean the surface of the wafer with a brush. The cleaning method is relatively old and requires a lot of manpower and time. At the same time, after manual cleaning Impurities are easy to remain on the surface of the wafer, resulting in poor cleaning effect

Method used

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  • A semiconductor wafer surface cleaning device
  • A semiconductor wafer surface cleaning device
  • A semiconductor wafer surface cleaning device

Examples

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Embodiment Construction

[0019] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. The following examples are intended to illustrate the present invention, but not to limit the scope of the present invention.

[0020] like Figure 1 to Figure 5 As shown, a semiconductor wafer surface cleaning device of the present invention, when working, turns on two sets of second motors 23, two sets of second motors 23 drive the rolling resistance screw 22 to rotate, and the two sets of screws 22 are respectively connected with The two sets of sliders 20 are screwed together, the two sets of lead screws 22 synchronously push the two sets of sliders 20 to move left and right, and the two sets of sliders 20 slide on the two sets of guide rails 19 respectively. They mesh with the bottoms of the two sets of gears 16 respectively. The two sets of sliders 20 respectively drive the two sets of gears 16 to rotate synchron...

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Abstract

The invention relates to the technical field of mechanical equipment, in particular to a semiconductor wafer surface cleaning device, which can conveniently improve the cleanliness of the wafer surface, improve the cleaning effect, and reduce the residue of impurities by automatically cleaning the wafer. Save physical strength and time during manual cleaning, improve work efficiency, improve practicability and reliability; including base, workbench, U-shaped frame, four sets of legs, two sets of tugboats and two sets of support grooves, set on the right side of the base There is a water supply device, the workbench is installed on the base, and the top of the workbench is provided with a feeding device horizontally. The U-shaped frame is located above the workbench and fixed on the outside of the top of the workbench by four sets of legs. Two sets of tugboats are respectively rotated and installed on the Front left and rear left of the U-frame.

Description

technical field [0001] The present invention relates to the technical field of mechanical equipment, in particular to a semiconductor wafer surface cleaning device. Background technique [0002] As we all know, a semiconductor wafer is mainly an electronic auxiliary component composed of silicon elements, which is usually a thin sheet type. When the wafer is processing and producing electronic components, it is necessary to clean up the impurities attached or remaining on the surface of the wafer, so as to ensure The cleanliness of the wafer surface prevents impurities from causing contamination and damage to electronic components. The existing cleaning method is mainly that workers clean the wafer surface with brushes. The cleaning method is relatively old and requires more manpower and time. At the same time, after manual cleaning The surface of the wafer is prone to residual impurities, resulting in poor cleaning effect. SUMMARY OF THE INVENTION [0003] In order to so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B1/00B08B1/04B08B3/02B08B13/00
CPCB08B1/008B08B1/04B08B3/024B08B13/00
Inventor 吴禹凡高洪庆
Owner 浙江汇隆晶片技术有限公司
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